Novel Probability Density Function of Pad Asperity by Wear Effect over Time in Chemical Mechanical Planarization
Seonho Jeong,
Yeongil Shin,
Jongmin Jeong
et al.
Abstract:Chemical mechanical planarization (CMP) reduces film thickness, eliminates step height, and achieves high levels of planarity in semiconductor manufacturing. However, research into its mechanisms is still in progress, and there are many issues to be resolved. To solve problems in CMP, it is necessary to understand the contact phenomenon that occurs at the pad–wafer interface, especially pad asperity. Moreover, understanding the non-uniform distribution of pad asperity, such as height and radius, is essential f… Show more
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