Novel periodic mesoporous organosilica thin film with low dielectric constant and high mechanical property

Abstract

A novel organosilane precursor, (hexfluoropropane-2,2-diyl)dibenzyl-bridged organosilane (HFPDBO) precursor, was prepared by a simple and facile synthesis. There are some superiorities designed in HFPDBO precursor, for instance, hexfluoro-substitutions and dibenzene can contribute to higher porosity and lower dielectric constant, rigid carbon bridged construction and tetrafunctional organosilane branches are beneficial to promoting polymerization and mechanical properties. Purified HFPDBO precursor were mixed with porogen Brij® L4, acid and ethanol for coating solution, and the HFPDBO-based PMO thin film was prepared via evaporation-induced self-assembly (EISA) method. The novel PMO thin film emerges excellent dielectric property (dielectric constants of 1.58@1 MHz) and high mechanical property (Young's modulus of 5.54±0.11 GPa), besides it shows order structure and hydrophobic property.