Novel Nanostructured Passives for RF and Power Applications: Nanopackaging with Passive Components

Raj, P. Markondeya; Chakraborti, Parthasarathi; Mishra, Dibyajat; Sharma, Himani; Gandhi, Saumya; Sitaraman, S.K.; Tummala, Rao

doi:10.1007/978-3-319-21194-7_11

Cited by 12 publications

(2 citation statements)

References 32 publications

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“…These components have become progressively smaller, b) from through‐hole and surface mounted device (SMD) packages to integrated passive devices (IPDs). Adapted with permission . Copyrights 2015, Springer International Publishing, Switzerland.…”

Section: Introductionmentioning

confidence: 99%

Shapeable Material Technologies for 3D Self‐Assembly of Mesoscale Electronics

Karnaushenko

Kang

Schmidt

2019

Adv Materials Technologies

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simple transistors and logics to highly integrated microcontrollers and displays, the latter of which utilizes some of the most technologically advanced processes available in the industry. [3] The success of these technologies has been achieved through enhanced integration of various active functional blocks such as transistors, digital logics, and analog circuits, along with advances in miniaturization and simplification of the overall manufacturing process, eventually leading to large scale, parallel fabrication of silicon chip-based microelectronic components and systems. [4,5] However, many of the manufacturing steps in assembling these electronic components remain either semiparallel or sequential in nature, including processes as dicing, pick and place, packaging, and final assembly of the device. Each additional sequential step increases costs and should ideally be avoided, however substantial streamlining is not always feasible in complex manufacturing processes. [6] More critically, highly integrated silicon-based devices still require several external supporting components for their operation such as wiring, powering, sensing, and communications that cannot be easily integrated within the planar surface of a silicon die. Thus, sensors, actuators, capacitors, coils, antennas, and optics, each crucial for the complete system, are typically placed separately from the silicon chip onto a printed circuit board (PCB), or integrated within another package (Figure 1a). While the need for ever decreasing sizes has demanded tremendous investments and efforts in the manufacture of completed assemblies, the miniaturizing of 3D electronic components (Figure 1b) and systems has nevertheless reached the range of mesoscopic sizes (<1 mm) where the manufacture and assembly of components experience challenges with respect to yield, costs, and reliability. [7] As a result, these issues limit the fabrication potential and commercial viability of components and systems to scales around 1 mm, [8] and despite efforts to improve the planar construction of mesoscopic 3D devices, the results are seen as inefficient and experience difficulties in achieving high performances while maintaining reasonable complexity. Despite the great success in manufacturing active electronics, such concerns are strongly related to the fabrication of passive electronic components like inductors, capacitors, antennas, and resonators where material properties (e.g., mechanical, magnetic, and electrical) and geometry play a crucial role. [8,9] In order to downscale these devices further and improve integration with active electronics, novel fabrication strategies are required.Electronic devices and their components are continually evolving to offer improved performance, smaller sizes, lower weight, and reduced costs, often requiring the state-of-the-art manufacturing and materials to do so. An emerging class of materials and fabrication techniques inspired by self-assembling biological systems shows promise as an alternative to the more traditional m...

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Section: Introductionmentioning

confidence: 99%

Shapeable Material Technologies for 3D Self‐Assembly of Mesoscale Electronics

Karnaushenko

Kang

Schmidt

2019

Adv Materials Technologies

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“…The possibility of enhancing and obtaining unique properties from ferrites by synthesizing it as nanocomposite material, with other compounds like Zn, Mg, Co, Ni etc., has opened a new and exciting research area. The ferrite crystalline structure, phase purity, electrical and magnetic properties are mainly dependent on the synthesis temperature [3]. Ferrites can be divided into two families based on the coercivity; they are: i.…”

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confidence: 99%

Study of Electrical and Magnetic Properties of Zn-Co-Ferrite Nanocomposites

Kumar¹,

Rashmi

Lalithamba

2022

jmmf

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The ferromagnetic material exhibits better magnetic properties as compared to other magnetic materials. Cobalt and ferrites have superior soft magnetic properties such as high permeability and magnetic susceptibility. A nanocomposite is prepared using Zinc, Cobalt and Ferrite by combustion synthesis method and the composition is Fe0.5Co0.25Zn0.25. The morphological properties are studied using FESEM images and XRD. The electrical and magnetic properties are studied from 10 Hz to 8 MHz frequency range using LCR meter at ambient temperature. The results show that with increase in frequency, the resistivity as well as permeability decreases. The values of electrical resistivity and dielectric constant suggest the suitability of the nanocomposites in power electronics devices.

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Embedded Passives

Raj

Lee

et al. 2016

Materials for Advanced Packaging

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Novel Nanostructured Passives for RF and Power Applications: Nanopackaging with Passive Components

Cited by 12 publications

References 32 publications

Shapeable Material Technologies for 3D Self‐Assembly of Mesoscale Electronics

Shapeable Material Technologies for 3D Self‐Assembly of Mesoscale Electronics

Study of Electrical and Magnetic Properties of Zn-Co-Ferrite Nanocomposites

Embedded Passives

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