Novel method to extract arrays of aligned carbon nanotube bundles from CNT film using solder ball grid arrays for higher performance device interconnects
Abstract:Carbon nanotubes (CNTs) are an attractive electrical interconnect material due to their excellent mechanical, electrical and thermal properties. Despite these advantages CNTs have not been widely adopted by industry primarily because of the difficulties associated with integrating CNTs into device electronics. In this paper we demonstrate that bundles of aligned CNTs can be extracted directly from a CNT film using solder ball grid arrays (BGA). The resulting CNT bundles adhere directly to the solder balls and … Show more
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