Novel method of separating macroporous arrays from p-type silicon substrate

Abstract

This paper presents a novel method to fabricate separated macroporous silicon using a single step of photo-assisted electrochemical etching. The method is applied to fabricate silicon microchannel plates in 100 mm p-type silicon wafers, which can be used as electron multipliers and three-dimensional Li-ion microbatteries. Increasing the backside illumination intensity and decreasing the bias simultaneously can generate additional holes during the electrochemical etching which will create lateral etching at the pore tips. In this way the silicon microchannel can be separated from the substrate when the desired depth is reached, then it can be cut into the desired shape by using a laser cutting machine. Also, the mechanism of lateral etching is proposed.

Study on the strain in a silicon microchannel plate by micro-Raman analysis

“…The whole system was controlled by a computer system. More details about the process can be found in [9][10][11]. Finally, the standard SiMCP circle samples in 16 mm diameter sizes were obtained through a 200 W CO 2 laser-cut machine (as shown in figure 1(a)).…”

“…Moreover, the lapping process may cause a block of the channels due to the particles generated during the lapping and polishing process. However, through controlling the backside illumination intensity and suitable bias simultaneously in the photo-assisted electrochemical etching process, the SiMCP can be separated from the substrate when the desired depth is reached (self-undercut) [9][10][11]. In this case, a SiMCP can be fabricated easily by typical microelectromechanical system techniques involving photo-assisted electrochemical etching and delaminating from the Si substrate by a modified electrochemical procedure.…”