Novel LTCC-/BGA-modules for highly integrated millimeter-wave transceivers

Heyen, Johann; Kerssenbrock, T. v.; Chernyakov, A. L.; Heide, P.; Jacob, Arne F.

doi:10.1109/mwsym.2003.1212547

Cited by 31 publications

(15 citation statements)

References 5 publications

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“…In [1] it has already been demonstrated that standard 2 nd level interconnections (e.g. ball grid array in Fig.…”

Section: Acp-flipchip Interconnectionmentioning

confidence: 98%

“…the interconnection between the module and its motherboard, is established by standard surface mount technologies like ball grid arrays. Multiple passive functions can be integrated in the inner layers of the multilayer MCM [1,2].…”

Section: Introductionmentioning

confidence: 99%

“…Recent results on ACP-based 1 st level flipchip interconnections up to 110 GHz [3] and 2 nd level interconnections [1] motivate to utilize ACP also for other millimeter-wave interconnections and package approaches.…”

Section: Introductionmentioning

confidence: 99%

“…Then, complementary to [1] and [3], the application of ACP to novel millimeter-wave package solutions is presented .…”

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

A novel package approach for multichip modules based on anisotropic conductive adhesives

Heyen¹,

Jacob²

2005

2005 European Microwave Conference

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“…In [1] it has already been demonstrated that standard 2 nd level interconnections (e.g. ball grid array in Fig.…”

Section: Acp-flipchip Interconnectionmentioning

confidence: 98%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

“…Then, complementary to [1] and [3], the application of ACP to novel millimeter-wave package solutions is presented .…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

A novel package approach for multichip modules based on anisotropic conductive adhesives

Heyen¹,

Jacob²

2005

2005 European Microwave Conference

Self Cite

View full text Add to dashboard Cite

show abstract

“…Previous papers have presented some interconnections and transitions [3,4]. They consist of microstrip to microstrip transition [5], microstrip to stripline transition [6], CPW to microstrip transition [9], CPW to CPW vertical transition [7], CPW to stripline transition [8]. However, there is still a useful and necessary transition for LTCC module development -the vertical transition between grounded coplanar waveguide (GCPW) and stripline.…”

Section: Introductionmentioning

confidence: 99%

A Broadband GCPW to Stripline Vertical Transition in LTCC

Zhang¹,

Li²,

Liu³

et al. 2016

PIER Letters

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Abstract-Vertical transition structure between grounded coplanar waveguide (GCPW) and stripline by Low Temperature Co-fired Ceramic (LTCC) technology is presented in this paper. In this structure, the top ground of the stripline is used as the GCPW lower ground, while the signal via goes through the middle ground plane. With increasing vertical signal via height, it can be more widely used in the higher height of multilayer System in Package (SiP) module packaging. The circular openings in the ground plane and additional shield vias around the transmission lines can provide great advantage in the radiation loss and decrease parasitic effects. The measurement results show that the return loss is less than −10 dB from 6 GHz to 35 GHz. Meanwhile, the insertion loss is better than −2 dB up to 28.4 GHz.

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Design of miniaturized LTCC baluns

Guo

Zhang

Ong

et al. 2006

Int J RF and Microwave Comp Aid Eng

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In this article, lumped-element loaded methods are examined for the purpose of achieving miniaturized low-temperature co-fired ceramic (LTCC) baluns. These methods have proven to be very efficient in reducing the size occupied by the baluns in these designs. Several miniaturized LTCC balun structures are analyzed using the even-odd mode analysis method and the design curves are plotted. Based on the design curves, two design examples in the LTCC environment are presented in order to demonstrate our analysis. The proposed analysis process is validated by the simulated and measured results.

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Novel LTCC-/BGA-modules for highly integrated millimeter-wave transceivers

Cited by 31 publications

References 5 publications

A novel package approach for multichip modules based on anisotropic conductive adhesives

A novel package approach for multichip modules based on anisotropic conductive adhesives

A Broadband GCPW to Stripline Vertical Transition in LTCC

Design of miniaturized LTCC baluns

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