We have newly developed non photosensitive and photosensitive polyimide having excellent electrical/mechanical properties. At first we have re-designed the polymer backbone in order to obtain low Dk and Df performance. As a result, our new non photosensitive PI achieved 2.9 of Dk at 20 GHz and 0.003 of Df at 20 GHz. In the next step, we selected the photo package of new PI carefully to maintain both low Dk/Df and high resolution. After that, we modified the photo initiator content, crosslinker content, and so on to have both high lithographic performance and high electrical performance. As a result, new photosentive PI cured at 320 °C showed 3.0 of Dk at 20 GHz and 0.006 of Df at 20 GHz. In addition, this material cured at 200 °C also showed 3.0 of Dk at 20 GHz and 0.009 of Df at 20 GHz. We also confirmed high mechanical properties of new PI. Elongation of this PI cured at >250 °C was approximately 70 %. From lithographic aspects, new PI achieved 15 μm L/S opening with 10 μm thickness.