Novel heat spreader for the optical probing of PC board mounted flip chips [microprocessor debug]

Boiadjieva, N.; Kelleher, Carmel; Dajee, G.; Nadig, S.

doi:10.1109/stherm.2003.1194375

Cited by 3 publications

(4 citation statements)

References 7 publications

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“…Previous work in [6,14,15] has shown that infrared thermography, combined with modeling, is a useful tool to validate possible dynamic power routing schemes. Measurement of the temperature map resulting from realistic processing traffic can be used to drive chip power models and will lead to more accurate representations of chip temperature for thermal designers.…”

Section: Introductionmentioning

confidence: 99%

“…In order to optically probe the chip during operation, an IR-transparent heatsink is required to maintain the chip's temperature below the critical temperature while maintaining high enough granularity [8][9][10] and contrast in the thermal map to be able to calculate the power map from the temperature map. Previous works [14] and [15] have developed microfluidic heatsinks to support infrared thermography of a microprocessor in operation.…”

Section: Introductionmentioning

confidence: 99%

“…This convolution of the temperature field will then complicate the calculation of a spatially-resolved power map. Boiadjieva et al,in [15], developed an air-cooled diamond-window heatsink and determined the impact of the chip's power on the heatsink temperature. The highly thermally conductive diamond window provided both optical access and heat spreading.…”

Section: Introductionmentioning

confidence: 99%

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Calibration methodology for interposing liquid coolants for infrared thermography of microprocessors

Hom

Durieux

Miler

et al. 2012

13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

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There have been unprecedented temperature nonuniformities reported in conventional 2D-and emerging 3D-packaged multi-core microprocessors. Therefore, techniques for spatially resolving chip power and temperature profiles in fully operational chips are needed to improve circuit design and enable optimal cooling solutions. This paper presents a high-resolution, infrared (IR) thermography technique for microprocessors operating at fully-operational power levels. A custom, microfluidic heat sink with an IR-transparent working fluid (0.75 LPM) is manufactured to cool an instrumented test chip while permitting optical access for IR thermal imaging. A detailed system calibration is conducted to account for the temperature-dependent optical properties of the chip and heat sink. It is concluded that the IR imaging can be conducted with ~ 0.1 °C error over the temperature range of 45-90 °C if the fluid plenum height is less than 500 μm. For a 2 mm channel, the error can be as high as 43°C due to strong signal attenuation in the fluid.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Calibration methodology for interposing liquid coolants for infrared thermography of microprocessors

Hom

Durieux

Miler

et al. 2012

13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

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confidence: 99%

Thermal Model of a Thinned-Die Cooling System

Boiadjieva¹,

Koev

2004

Journal of Electronic Packaging

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For through-silicon optical probing of microprocessors, the heat generated by devices with power over 100W must be dissipated [1]. To accommodate optical probing, a seemingly elaborate cooling system that controls the microprocessor temperature from 60 to 100°C for device power up to 150 W was designed [2]. The system parameters to achieve the desired thermal debug environment were cooling air temperature and air flow. A mathematical model was developed to determine both device temperature and input power. The 3D heat equation that governs the temperature distribution was simplified to a case of a 1D rod with one end at the device center and the other at the cooling air intake. Thus the cooling system was reduced to an analytical expression. From experimental data, we computed all coefficients in the model, then ran extensive tests to verifythe accuracy was better than 10% over the entire temperature and power ranges.

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Thermal Model of a Thinned-Die Cooling System

Boiadjieva¹,

Koev

2003

Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology

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For through-silicon optical probing of microprocessors, the heat generated by devices with power over 100W must be dissipated [1]. To accommodate optical probing, a seemingly elaborate cooling system that controls the microprocessor temperature from 60 to 100° C for device power up to 150W was designed [2]. The system parameters to achieve the desired thermal debug environment were cooling air temperature and air flow. A mathematical model was developed to determine both device temperature and input power. The 3-D heat equation that governs the temperature distribution was simplified to a case of a 1-D rod with one end at the device center and the other at the cooling air intake. Thus the cooling system was reduced to an analytical expression. From experimental data, we computed all coefficients in the model, then ran extensive tests to verify—the accuracy was better than 10% over the entire temperature and power ranges.

show abstract

Novel heat spreader for the optical probing of PC board mounted flip chips [microprocessor debug]

Cited by 3 publications

References 7 publications

Calibration methodology for interposing liquid coolants for infrared thermography of microprocessors

Calibration methodology for interposing liquid coolants for infrared thermography of microprocessors

Thermal Model of a Thinned-Die Cooling System

Thermal Model of a Thinned-Die Cooling System

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