Novel heat resistant nanostructure poly(amide–imide)s containing new TMA-based diacid via conventional polycondensation reaction in an ionic green medium: synthesis, morphology, and thermal properties

Abstract

The 4,4′-Methylenebis(3-chloro-2,6-diethylaniline) has been reacted with two moles of trimellitic anhydride in refluxing N,N′-dimethylformamide to obtain 4,4′-Methylenebis(3-chloro-2,6-diethyl trimellitimidobenzene) for the first time. A series of novel poly(amide-imide)s (PAIs) was synthesized by the direct polycondensation of the synthesized diimidediacid with various commercial diamines. The direct polyamidation was performed under conventional heating reaction using tetra-n-butylammonium bromide and triphenyl phosphite as a condensing agent. The PAIs were obtained in good yields and moderate inherent viscosity up to 0.48 dL/g. Although the polymers were not soluble in low polar solvents tested, they were thoroughly dissolved in high polar solvents and even in a moderate polar solvent such as pyridine. The crystallinity of the prepared PAIs was measured by XRD scans. No remarkable crystal diffraction was detected for the polymers obtained, and they showed almost an amorphous diffraction patterns. The thermal behavior of the polymers was evaluated by thermogravimetric analysis (TGA) technique. This study showed obviously one-stage decomposition at elevated temperatures. On the basis of TGA data, such polymers are thermally stable and can be classified as self-extinguishing polymers. The structural features of these polymers were verified by elemental analysis, fourier transform infrared spectroscopy, and 1 H-NMR spectroscopies. The field emission scanning electron microscopy (FE-SEM) micrographs showed the obtained PAIs have nanostructure morphology. The effect of ultrasonic irradiation on the polymer morphology was studied. The FE-SEM micrographs illustrated that the morphology of macromolecules after ultrasonication became more homogenous than it is before ultrasonic radiation.

Facile Approach to Prepare Poly(amide–imide)/ZnO Nanocomposites Derived from L-leucine-Based Diacid and 4,4′-Sulfonyldianiline: Using Ultrasound Irradiation and Ionic Liquid

“…Comparing with the polyimide and polyamide, the PAI own the better heat resistant properties and process ability [7][8][9] . PAI enriched with a naturally amino acid is optically active and biodegradable and has manifest properties such as high thermal stability, good mechanical properties and good chemical resistance [10,11] .…”

Synthesis and characterization of new unsymmetrical diamine monomer and polyimides

“…IR (KBr): 1590 and 1340 cm À1 (-NO 2 stretch), 1237 cm À1 (C-O-C stretch), 3075 cm À1 (C-H aromatic stretch) 3476 and 3379 cm À1 (-NH 2 stretch). 1 [15,[21][22][23] The mixture was heated at reflux temperature for 6 h. After complete reduction of the nitro group, the reaction mixture was cooled and poured into water. The solution was neutralized by using dilute NaOH solution, the precipitate containing diamine and inorganic impurities was collected by filtration.…”

“…Aromatic polyimides [1][2][3][4][5] are widely used in aerospace, automobile, electronics, and other high technology fields due to their excellent thermal, mechanical properties, and stability to radiation and chemical reagents. [6][7][8] The polyimides have rigid molecular chains, resulting in poor solubility in common organic solvents and this inevitably affects their synthesis, processing, and application.…”

Morphological and Thermal Properties of Poly(amide-imide)/ZnO Nanocomposites Derived from 4,4′-methylenebis(3-chloro-2,6-diethyl trimellitimidobenzene) and 3,5-diamino-N-(4-hydroxyphenyl)benzamide

“…Structural modifications improve their processing properties. One of these modifications is the preparation of copolymers such as PAIs, which are high-performance materials with good compromise between thermal stability and process ability when compared to polyamides or polyimides of analogous structure [22][23][24][25] . PAIs have been widely employed as adhesives, electronic materials, composite materials, fiber, and film materials.…”