Novel electrically conductive epoxy/reduced graphite oxide/silica hollow microspheres adhesives with enhanced lap shear strength and thermal conductivity

Aradhana, Ruchi; Mohanty, Smita; Nayak, Sanjay K.

doi:10.1016/j.compscitech.2018.11.008

Cited by 49 publications

(18 citation statements)

References 21 publications

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“…As the critical point is not obvious, this theory is controversial. Many experimental results prove the correctness of this theory [50,[53][54][55].…”

Section: Thermal Conduction Mechanismsmentioning

confidence: 62%

Recent Advances in Preparation, Mechanisms, and Applications of Thermally Conductive Polymer Composites: A Review

Zhang

Zhou

et al. 2020

J. Compos. Sci.

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At present, the rapid accumulation of heat and the heat dissipation of electronic equipment and related components are important reasons that restrict the miniaturization, high integration, and high power of electronic equipment. It seriously affects the performance and life of electronic devices. Hence, improving the thermal conductivity of polymer composites (TCPCs) is the key to solving this problem. Compared with manufacturing intrinsic thermally conductive polymer composites, the method of filling the polymer matrix with thermally conductive fillers can better-enhance the thermal conductivity (λ) of the composites. This review starts from the thermal conduction mechanism and describes the factors affecting the λ of polymer composites, including filler type, filler morphology and distribution, and the functional surface treatment of fillers. Next, we introduce the preparation methods of filled thermally conductive polymer composites with different filler types. In addition, some commonly used thermal-conductivity theoretical models have been introduced to better-analyze the thermophysical properties of polymer composites. We discuss the simulation of λ and the thermal conduction process of polymer composites based on molecular dynamics and finite element analysis methods. Meanwhile, we briefly introduce the application of polymer composites in thermal management. Finally, we outline the challenges and prospects of TCPCs.

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“…As the critical point is not obvious, this theory is controversial. Many experimental results prove the correctness of this theory [50,[53][54][55].…”

Section: Thermal Conduction Mechanismsmentioning

confidence: 62%

Recent Advances in Preparation, Mechanisms, and Applications of Thermally Conductive Polymer Composites: A Review

Zhang

Zhou

et al. 2020

J. Compos. Sci.

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“…Aradhana et al have reported that the electrical conductivity of epoxy adhesive using rGO and silica hollow microspheres as hybrid fillers showed an increment of six orders of magnitude (8.06 × 10 −9 S/cm) at a ratio of 50:10 (31.5 g rGO and 6.3 silica hollow microspheres). [ 43 ]…”

Section: Resultsmentioning

confidence: 99%

“…[ 48 ] An enhancement of 11% in unnotched impact strength has been noticed in epoxy nanocomposites containing rGO /silica hollow microspheres. [ 43 ] In case of higher filler loadings of P@G, the impact strength was found to diminish which probably may be due to agglomeration of fillers which can develop flaws and thereby result in lower energy absorption. For epoxy/PANI nanocomposites, the impact strength decreased considerably with the addition of PANI.…”

Section: Mechanical Propertiesmentioning

confidence: 99%

Polyaniline nanorod adsorbed on reduced graphene oxide nanosheet for enhanced dielectric, viscoelastic and thermal properties of epoxy nanocomposites

Kunju

Gopalakrishnan

2021

Polymer Engineering & Sci

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In this work, polyaniline nanorod adsorbed on reduced graphene oxide (P@G) hybrid filler was prepared via in situ polymerization of aniline monomer in the presence of reduced graphene oxide as template. Fourier transform infrared, X‐ray diffraction, field emission scanning electron microscopy, and high‐resolution transmission electron microscopy images revealed the formation of P@G hybrid. The P@G hybrid was dispersed in dichlorobenzene and then introduced into epoxy resin at different loadings. The epoxy nanocomposites containing 9 wt% P@G hybrids (E/P@G9) exhibited a maximum DC conductivity of 1.34 × 10−5 S/cm that is eight orders higher compared to pure epoxy. At 103 Hz, a dielectric constant (ε′) of 163 was attained for E/P@G9, nearly 34 times higher than pure epoxy. A percolation threshold of 4 vol% was observed for ε′. Dynamic mechanical studies showed that significant enhancement in storage modulus values were exhibited for 3 and 5 wt% of hybrids. The glass transition temperature showed a maximum shift of 10°C to higher temperatures at 3 wt% loading of P@G hybrids (E/P@G3). The tensile strength, Young's modulus, and impact strength of the E/P@G3 nanocomposites enhanced by 19.7, 72, and 12%, respectively. The thermal stability of the epoxy nanocomposites also enhanced with the addition of P@G hybrid.

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“…They find a wide range of applications among aerospace structures, electromagnetic interference shielding systems, sensors, thermally conductive materials, and conductors and are even used as metal replacements. [ 1–4 ] In the development of High tension low sag (HTLS) conductors for overhead transmission lines, manufacturers have come up with many variants of the composite core with better mechanical properties. However, there is only limited published research on the aspects of core materials associated with thermal and electrical properties.…”

Section: Introductionmentioning

confidence: 99%

Analysis of Epoxy Nanocomposites Characteristics by Impedance Spectroscopy

Rashmi¹,

Sailaja

Bhaskaran³

2021

Macromolecular Symposia

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The research work is carried out to analyse the electrical characteristics of glass fiber reinforced epoxy composites with the addition of multiwall carbon nanotubes and graphene nanoplatelets. The dispersion of 2wt.% multi walled carbon nanotubes(MWCNT) and 1-3wt.% graphene nanoplatelets (GNP) into the epoxy resin is assisted with high shear mechanical mixing followed by ultrasonication. The epoxy-filler mixture is transferred into temperature-controlled resin bath for pultrusion process. The pultrusion process helps to resolve major issues like poor dispersion and agglomeration of nanofillers in epoxy resin. The XRD and SEM analysis indicates that fillers are dispersed homogeneously in the epoxy matrix. The electrical conductivity ( ) and impedance (Z) are studied in the frequency range (10 Hz-8 MHz) with the variation in temperature (over 25°C-150°C). It is observed that the addition of two conductive nanofillers results in a synergistic effect at the percolation threshold, and the conductivity value increases by few orders due to the formation of a number of conductive paths in the composite. The complex impedance decreases with increase in frequency for the composites except for the sample with 3wt.% GNP and 2wt.% MWCNT indicating the semiconducting behaviour. The complex impedance plot is characterized by the appearance of a single semi-circular arc whose radii of curvature decreases with an increase in temperature, indicating the existence of electrical relaxation phenomena.

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Novel electrically conductive epoxy/reduced graphite oxide/silica hollow microspheres adhesives with enhanced lap shear strength and thermal conductivity

Cited by 49 publications

References 21 publications

Recent Advances in Preparation, Mechanisms, and Applications of Thermally Conductive Polymer Composites: A Review

Recent Advances in Preparation, Mechanisms, and Applications of Thermally Conductive Polymer Composites: A Review

Polyaniline nanorod adsorbed on reduced graphene oxide nanosheet for enhanced dielectric, viscoelastic and thermal properties of epoxy nanocomposites

Analysis of Epoxy Nanocomposites Characteristics by Impedance Spectroscopy

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