Novel diamond conditioner dressing characteristics of CMP polishing pad

Tsai, Ming-Yen; Chen, Shun Tong; Liao, Yi‐Hung; Sung, James C.

doi:10.1016/j.ijmachtools.2009.03.001

Cited by 51 publications

(27 citation statements)

References 9 publications

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“…Similarly, research on incorporating macro-features onto the surface of abrasives in order to enhance dressing performance has been reported, particularly in the case of chemical mechanical polishing (CMP) pads for integrated circuits [219]. Simple/plain geometry roller dressers are primarily employed to prepare wheels used for grinding parts without complex profiles, where the associated kinematics are relatively straightforward consisting of only rotational and translational components along the wheel surface.…”

Section: Current Wheel Preparation Methods and State-of-the-artmentioning

confidence: 99%

Abrasive machining of advanced aerospace alloys and composites

et al. 2015

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Section: Current Wheel Preparation Methods and State-of-the-artmentioning

confidence: 99%

Abrasive machining of advanced aerospace alloys and composites

et al. 2015

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“…Not only is its lifecycle shortened, but it is hard to predict the right timing for pad replacement [4]. Besides, the reacting chemical is gradually consumed on a silicon wafer surface, leading to scratches on the silicon wafer produced by the thick, sticky grinding slurry and causing serious environmental problems because of the hazardous chemicals involved [5][6][7].…”

Section: Introductionmentioning

confidence: 99%

A Study of Polishing Feature of Ultrasonic-Assisted Vibration Method in Bamboo Charcoal

Lee

Chen

2017

Advances in Materials Science and Engineering

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Focusing on the feature of porosity in bamboo charcoal, this study applies the ultrasonic-assisted vibration method to perform surface polishing of the silicon wafer workpiece. The self-developed bamboo charcoal polishing spindle and ultrasonic-assisted vibration mechanism are attached to a single lapping machine. In the machining process, ultrasonic vibration enables the diamond slurry to smoothly pass through the microscopic holes of bamboo charcoal; the end of the bamboo charcoalis able to continue machining on the surface of the workpiece through the grasping force which exists in the microscopic holes. Under the polishing and machining parameters of ultrasonic-assisted vibration, with a diamond slurry concentration of 0.3%, the experimental results show a polishing time of 20 min, a loading of 25 N on the workpiece surface, a spindle speed of 1200 rpm, a vibration frequency of 30 kHz and the original surface roughness value of Ra 0.252 m equals that of a mirror-like surface at Ra 0.017 m. These research results prove that by using bamboo charcoal and ultrasonic-assisted vibration for polishing, a very good improvement can be achieved on the workpiece surface.

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“…For instance, employing an extra cathode, a shielding plate, and also adding a leveling agent can enhance the thickness uniformity of electroformed microcomponents. Nevertheless, attaining uniform distribution and height leveling of diamond grits are considered the main challenges in fabricating ideal diamond conditioners [11][12][13].…”

Section: Introductionmentioning

confidence: 99%