Novel correction methods on a miniature tensile device based on a modular non-standard layout

Ma, Zhichao; Zhao, Hongwei; Wang, Kaiting; Zhou, Xiaoqin; Hu, Xiaoli; Lü, Shuai; Cheng, Hongbing

doi:10.1088/0957-0233/24/8/085901

Cited by 14 publications

(13 citation statements)

References 32 publications

(44 reference statements)

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“…During the three-point bending testing, a uniaxial bending load is continuously applied on a carefully prepared specimen and the corresponding deflection is recorded. Therefore, the testing device's stiffness and the veracity of deflection are required to be taken into account [8,9]. Many attempts have been made to carry out the bending tests on function materials [10], semiconductor materials [5,11] and structure materials [1,2,7], such as Fist et al [5], who proposed a three-point bending device to study the vibrational response of ZrB 2 + SiC and LaCoO 3 ceramics.…”

Section: Introductionmentioning

confidence: 99%

Modular correction method of bending elastic modulus based on sliding behavior of contact point

Ma¹,

Zhao²,

Zhang³

et al. 2015

Meas. Sci. Technol.

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During the three-point bending test, the sliding behavior of the contact point between the specimen and supports was observed, the sliding behavior was verified to affect the measurements of both deflection and span length, which directly affect the calculation of the bending elastic modulus. Based on the Hertz formula to calculate the elastic contact deformation and the theoretical calculation of the sliding behavior of the contact point, a theoretical model to precisely describe the deflection and span length as a function of bending load was established. Moreover, a modular correction method of bending elastic modulus was proposed, via the comparison between the corrected elastic modulus of three materials (H63 copper–zinc alloy, AZ31B magnesium alloy and 2026 aluminum alloy) and the standard modulus obtained from standard uniaxial tensile tests, the universal feasibility of the proposed correction method was verified. Also, the ratio of corrected to raw elastic modulus presented a monotonically decreasing tendency as the raw elastic modulus of materials increased.

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Section: Introductionmentioning

confidence: 99%

Modular correction method of bending elastic modulus based on sliding behavior of contact point

Ma¹,

Zhao²,

Zhang³

et al. 2015

Meas. Sci. Technol.

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“…Young's modulus measured by uniax ial tensile testing is affected by many inevitable factors, such as misalignment of the tensile axis [6][7][8][9], initial residual stress [10] and clamping position [4]. Regarding the effects of these factors on the testing accuracy of Young's modulus, relevant theoretical models [8,11,12] and correcting methods [4,13] have been established and have provided references for the accurate calcul ation and error calibration of Young's modulus of bulk materials. However, regarding microsized specimens, because the clamp ing and measurement methods of load and displacement are dif ferent [14], these models and methods might not be appropriate.…”

Section: Introductionmentioning

confidence: 99%

“…In addition, in situ tensile testing under scanning/transmission Measurement error of Young's modulus considering the gravity and thermal expansion of thin specimens for in situ tensile testing Zhichao Ma 1,2 , Hongwei Zhao 1,3 and Luquan Ren 2 electron microscopes (SEM/TEM) or optical microscopes is beneficial for understanding the failure mechanism of materials and could be used to investigate the relation between the evol ution behaviors of microstructure and mechanical properties [4,15]. At present, most miniature in situ tensile devices compat ible with SEM/TEM or optical microscopes adopt a horizon tal layout [13]. On one hand, under optical imaging conditions, the imaging quality is very sensitive to the distance between the lens and the specimen's upper surface, on the other hand, the gravity of the specimen would not only cause a deflection at the midpoint but also affect the initial gage length of the specimen.…”

Section: Introductionmentioning

confidence: 99%

Measurement error of Young’s modulus considering the gravity and thermal expansion of thin specimens forin situtensile testing

Ma¹,

Zhao²,

Liu³

2016

Meas. Sci. Technol.

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Most miniature in situ tensile devices compatible with scanning/transmission electron microscopes or optical microscopes adopt a horizontal layout. In order to analyze and calculate the measurement error of the tensile Young's modulus, the effects of gravity and temperature changes, which would respectively lead to and intensify the bending deformation of thin specimens, are considered as influencing factors. On the basis of a decomposition method of static indeterminacy, equations of simplified deflection curves are obtained and, accordingly, the actual gage length is confirmed. By comparing the effects of uniaxial tensile load on the change of the deflection curve with gravity, the relation between the actual and directly measured tensile Young's modulus is obtained. Furthermore, the quantitative effects of ideal gage length l o , temperature change ΔT and the density ρ of the specimen on the modulus difference and modulus ratio are calculated. Specimens with larger l o and ρ present more obvious measurement errors for Young's modulus, but the effect of ΔT is not significant. The calculation method of Young's modulus is particularly suitable for thin specimens.

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“…Micro-electromechanical-based sensor (MEMS) devices allow short response time and high sensitivity. Cheap and fast production of these devices is the result of progress in micro-technology in the last decade [8][9][10].…”

Section: Introductionmentioning

confidence: 99%

Behavior of Current Flow on Lead Zirconate Titanate Surfaces during Mechanical Impact

Aman¹

2016

Res. Rev. J Mat. Sci

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A new mechanical stress detection technique, based on current flow at Lead Zirconium Titanate (PZT) surfaces, is described in this paper. The current flow properties of PZT were characterized by use of a tungsten indenter. The tungsten indenter was dropped from a certain height and caused mechanical impact at the PZT-sample. The tungsten pin achieved direct contact with the upper surface of the ferroelectric specimen during the impact. This procedure allowed measurements of electrical current that flew between the PZT-surface and the tungsten pin. It was shown that ferroelectric domain switching on PZT surface and plastic deformation generates this current flow during action of loading force. The current flow disappeared in a few microseconds after removal of the loading force. The measurements were carried out using different areas of force application on the PZT surface. The mechanical stress, induced by the collision, was transmitted through the sample and generated also a measureable dipole moment. In this way it was shown that PZT exhibits high sensitivity against mechanical stress by means of electrical current flow, compared to typical dipole moment measurements. This specific material property of PZT-ceramics can be used for new mechanical stress sensor designs with higher sensitivity as normal used bulky PZT-sensors.

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Novel correction methods on a miniature tensile device based on a modular non-standard layout

Cited by 14 publications

References 32 publications

Modular correction method of bending elastic modulus based on sliding behavior of contact point

Modular correction method of bending elastic modulus based on sliding behavior of contact point

Measurement error of Young’s modulus considering the gravity and thermal expansion of thin specimens forin situtensile testing

Behavior of Current Flow on Lead Zirconate Titanate Surfaces during Mechanical Impact

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