2017 IEEE Applied Power Electronics Conference and Exposition (APEC) 2017
DOI: 10.1109/apec.2017.7931133
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Novel cooling technology to reduce thermal impedance and thermomechanical stress for SiC application

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Cited by 6 publications
(4 citation statements)
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“…Thermomechanical formulations for thin-walled structures have many applications. Examples from technology are sheet metal forming [1], gas turbine blades [2], cooling systems for circuit boards [3], overcoming transistor fatigue [4], batteries [5], and solar cells [6]. Examples from nature are lipid membranes [7] and leaves [8].…”
Section: Introductionmentioning
confidence: 99%
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“…Thermomechanical formulations for thin-walled structures have many applications. Examples from technology are sheet metal forming [1], gas turbine blades [2], cooling systems for circuit boards [3], overcoming transistor fatigue [4], batteries [5], and solar cells [6]. Examples from nature are lipid membranes [7] and leaves [8].…”
Section: Introductionmentioning
confidence: 99%
“…For the partitioning, either isothermal or adiabatic splits can be used. 3 The latter method can be shown to be unconditionally stable [81,82].…”
Section: Introductionmentioning
confidence: 99%
“…Thermomechanical formulations for thin-walled structures have many applications. Examples from technology are sheet metal forming [1], gas turbine blades [2], cooling systems for circuit boards [3], fatigue of transistors [4], batteries [5], solar cells [6]. Examples from nature are lipid membranes [7] and leaves [8].…”
Section: Introductionmentioning
confidence: 99%
“…Some innovative designs are developed to enhance the power dissipation and reduce the thermal resistance, including optimized heat sink structure [33], [34], integrated baseplate with Pin-Fin or Power-Shower technologies [13], 3D printed heat sink [35], nano-scale thermal interface material [36], cold spray low temperature soldering [37], etc. Besides, from the viewpoint of the digital controller, active thermal management is presented to on-line regulate the power losses of power devices, by using an adaptive switching frequency or an adjustable dc-link voltage [38].…”
mentioning
confidence: 99%