2022
DOI: 10.3390/polym14020275
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Novel Composite Planks Made of Shape Memory Polyurethane Foaming Material with Two-Step Foaming Process

Abstract: In this study, shape memory polyurethane (SMP) foaming material is used as the main material that is incorporated with carbon fiber woven fabrics via two-step foaming method, forming sandwich-structured composite planks. The process is simple and efficient and facilitates any composition as required. The emphasis of this study is protection performances, involving puncture resistance, buffer absorption, and electromagnetic wave shielding effectiveness. The proposed soft PU foam composite planks consist of the … Show more

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Cited by 5 publications
(5 citation statements)
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References 39 publications
(37 reference statements)
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“…In a work, nanoclay filled PLA/PU nanoarchitectures yarn was constructed with high twist. [81] The twisted yarn then underwent shaping to a coiled architecture via mandrel Figure 15. Shape memory responsivity of TPU@CB@CNC nanoarchitectures.…”
Section: Nanoclay Shape Memory Polymeric Nanoarchitecturesmentioning
confidence: 99%
“…In a work, nanoclay filled PLA/PU nanoarchitectures yarn was constructed with high twist. [81] The twisted yarn then underwent shaping to a coiled architecture via mandrel Figure 15. Shape memory responsivity of TPU@CB@CNC nanoarchitectures.…”
Section: Nanoclay Shape Memory Polymeric Nanoarchitecturesmentioning
confidence: 99%
“…The amorphous region supports the stabilisation and retention of the original shape, and then the deformation of this region induces shape recovery. In contrast, the crystalline region is responsible for obstructing shape recovery until a critical condition is met [23,41,56,57].…”
Section: Polymermentioning
confidence: 99%
“…Among these, the addition of inorganic conductive fillers is the most frequently employed approach. Commonly utilized inorganic conductive fillers mainly include carbon fillers [carbon black (CB), carbon nanotubes (CNT), graphene, carbon fibers, ] and metal fillers. CB stands out as the most widely used inorganic conductive filler for improving the conductivity of reticulated PUFs due to the easy availability of raw materials, low price, and the stability of conductivity and long-lasting performance. However, the construction of conductive networks requires a high concentration of conductive fillers, which corresponds to a high percolation threshold .…”
Section: Introductionmentioning
confidence: 99%