Novel comparative torsional analytical technique to predict mechanical reliability of emerging memory cards and packages

Wong, Jing Ying; Jun, Hu; Yong, Leow Chiap; Chew, Sheng

doi:10.1109/eptc.2006.342813

2006 8th Electronics Packaging Technology Conference 2006

DOI: 10.1109/eptc.2006.342813

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Novel comparative torsional analytical technique to predict mechanical reliability of emerging memory cards and packages

Jing Ying Wong

Hu Jun

Leow Chiap Yong

et al.

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Novel comparative torsional analytical technique to predict mechanical reliability of emerging memory cards and packages

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References 2 publications

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