Novel Approach to Highly Robust Fine Pitch RDL Process

Choi, Jae-yoon; Jin, Jeongi; Kang, Gyuho; Hwang, Hyunsu; Kim, Byungchan; Yun, Hyeok; Park, Jumyong; Lee, Chungsun; Kang, Un-Byoung; Lee, Jong-Ho

doi:10.1109/ectc32696.2021.00352

Cited by 6 publications

(3 citation statements)

References 5 publications

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“…The sums of the Z-direction reaction forces of all nodes applied and the displacement loads in CaseP and CaseV are FRDP: −7.174 × 10 −3 N and FRDV: −6.464 × 10 −3 N, respectively. The reaction force errors serve as accuracy indicators, as shown in (12). The sums of the Z-direction reaction forces of all nodes applied and the displacement loads in CaseP and CaseV are FR DP : −7.174 × 10 −3 N and FR DV : −6.464 × 10 −3 N, respectively.…”

Section: Methods Validationmentioning

confidence: 99%

Section: Methods Validationmentioning

confidence: 99%

“…To enable high-bandwidth signal processing between chiplets [ 10 ], several techniques, such as dual damascene processing, semi-additive processing (SAP) and polymer damascene processing, have been introduced. These techniques narrow the RDL trace width/pitch to as small as two microns [ 11 , 12 ] and even sub-microns [ 13 ]. To enhance the electricity transmission capacity, traces become thicker, with an aspect ratio of up to 4.2 [ 14 ], which is very different from traditional shell-like thin traces.…”

Section: Introductionmentioning

confidence: 99%

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An RDL Modeling and Thermo-Mechanical Simulation Method of 2.5D/3D Advanced Package Considering the Layout Impact Based on Machine Learning

Wu,

Wang,

et al. 2023

Micromachines

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The decreasing-width, increasing-aspect-ratio RDL presents significant challenges to the design for reliability (DFR) of an advanced package. Therefore, this paper proposes an ML-based RDL modeling and simulation method. In the method, RDL was divided into blocks and subdivided into pixels of metal percentage, and the RDL was digitalized as tensors. Then, an ANN-based surrogate model was built and trained using a subset of tensors to predict the equivalent material properties of each block. Lastly, all blocks were transformed into elements for simulations. For validation, line bending simulations were conducted on an RDL, with the reaction force as an accuracy indicator. The results show that neglecting layout impact caused critical errors as the substrate thinned. According to the method, the reaction force error was 2.81% and the layout impact could be accurately considered with 200 × 200 elements. For application, the TCT maximum temperature state simulation was conducted on a CPU chip. The simulation indicated that for an advanced package, the maximum stress was more likely to occur in RDL rather than in bumps; both RDL and bumps were critically impacted by layouts, and RDL stress was also impacted by vias/bumps. The proposed method precisely concerned layout impacts with few resources, presenting an opportunity for efficient improvement.

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Section: Methods Validationmentioning

confidence: 99%

Section: Methods Validationmentioning

confidence: 99%