2018 International Conference on Optical MEMS and Nanophotonics (OMN) 2018
DOI: 10.1109/omn.2018.8454624
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Novel 512 × 320 Tip-Tilt Micro Mirror Array in a CMOS-Integrated, Scalable Process Technology

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Cited by 5 publications
(2 citation statements)
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“…The output beams are diffraction limited and can fully support the theoretical number of resolvable spots of 160 × 160. To overcome the pin-count limit, the MEMS OPA can be fabricated on a CMOS wafers to integrate the addressing electronics, as demonstrated in commercial digital light processing (DLP) projectors [33] and micromirror arrays for wavefront control [34]. Lower temperature MEMS materials such as low-stress metals [33,34] or polycrystalline silicon-germaniums [35] are compatible with postprocessing of CMOS wafers.…”
Section: Resultsmentioning
confidence: 99%
“…The output beams are diffraction limited and can fully support the theoretical number of resolvable spots of 160 × 160. To overcome the pin-count limit, the MEMS OPA can be fabricated on a CMOS wafers to integrate the addressing electronics, as demonstrated in commercial digital light processing (DLP) projectors [33] and micromirror arrays for wavefront control [34]. Lower temperature MEMS materials such as low-stress metals [33,34] or polycrystalline silicon-germaniums [35] are compatible with postprocessing of CMOS wafers.…”
Section: Resultsmentioning
confidence: 99%
“…MMA devices developed at Fraunhofer IPMS have been successfully applied during the last decades in industrial photolithography tools, being fine-tuned to work in the ultraviolet spectral range. Nevertheless, further customizations of this MMA technology are possible in order to optimize the SLM characteristics for new emerging application fields, such as: laser beam steering [2], microscopy [3] and holography [4].…”
Section: Introductionmentioning
confidence: 99%