Novel 3D modeling of In 0.53 Ga 0.47 As lateral PIN photodiode

Abstract

The lateral PIN photodiode (LPP) can be fabricated with ease using standard CMOS techniques such as diffusion or ion implantation to form the p+ and n+ wells in the absorbing layer. A novel diffusion-based three-dimensional LPP was modeled utilizing In 0.53 Ga 0.47 As as the absorbing layer. Interdigitated electrode structures were used to obtain responsivity of ~0.5-0.6 A/W and -3dB frequency of ~14-15 GHz at a wavelength of 1550 nm, bias voltage of 5V and optical power of 10 Wcm -2 . The modeled device is able to cater for 10 Gbit/s optical communication networks.