Note: Thermally removable epoxy adhesives incorporating thermally reversible diels-alder adducts

Aubert, J.

doi:10.1080/00218460309540

Cited by 102 publications

(80 citation statements)

References 4 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…This band can be observed at 1714 cm À1 for the RE1 resin, with the emergence of a second carbonyl band at 1774 cm À1 [15,16]. The emergence of the latter band in the RE1 spectrum has been attributed to the formation of the succinimide groups based on the Diels-Alder adduct of maleimides [17,18]. The band has been associated with the formation of the Diels-Alder adduct.…”

Section: Ftir Analysismentioning

confidence: 99%

Thermally Induced Changes in the Chemical and Mechanical Properties of Epoxy Foam

Kinyanjui

Hatchett

2010

Journal of Cellular Plastics

View full text Add to dashboard Cite

The influence of thermal treatment on the chemistry, physical, and mechanical properties of epoxy foam was evaluated. The foam was subjected to repeated thermal cycles (25-958C), encompassing the temperature regime in which the forward and the retro Diels-Alder reaction occurs. Changes in the chemistry of the foam were evaluated using in situ FTIR spectroscopy during thermal exposure. In addition, the structural siloxane units within the epoxy foam were identified and evaluated using FTIR analysis. Thermal analysis was used to evaluate expansion, degradation, and mass loss during thermal exposure. Finally, the physical and mechanical properties were evaluated to determine how thermal cycling influences the density and modulus of the epoxy foam. Thermal exposure below the temperature required for the breakage of conjugated double bonds via Diels-Alder mechanism increases thermal expansion influencing the structural integrity and packing of siloxane chains. The data indicates that the chemical changes and the thermal expansion of the foam are irreversible. The combination of thermal expansion and the change in chemistry for the system strongly diminished the structural rigidity of the foam lowering the density and modulus of the material.

show abstract

Section: Ftir Analysismentioning

confidence: 99%

Thermally Induced Changes in the Chemical and Mechanical Properties of Epoxy Foam

Kinyanjui

Hatchett

2010

Journal of Cellular Plastics

View full text Add to dashboard Cite

show abstract

“…The While adhesives are normally expected to maintain their performance indefi nitely, recycling and/or repairing requires that the adhesion be reversed. Thermally reversible adhesives have been synthesized by reacting an aliphatic diamine with a diepoxy compound containing two Diels -Alder adducts [116] . The Diels -Alder adduct was formed by reacting a furfuryl glycidyl ether (diene) with 1,1 ′ -(methylenedi -4,1 -phenylene) -bismaleimide (dienophile) (Figure 11.7 ) .…”

Section: Adhesivesmentioning

confidence: 99%

In Coatings, Adhesives, and Laminates

Rawlins

Mendon

2008

Polymer Grafting and Crosslinking

View full text Add to dashboard Cite

“…The characteristic shared by each of the non-autonomous systems is that the structural framework of the material contains a reversible, or dynamic, chemical bond (Williams et al , 2008). The most common healing mechanism is based on reversible covalent bonds following the Diels-Alder mechanism (Canadell et al , 2010;Wouters et al , 2009;Aubert, 2003;Bergman and Wudl, 2008;Park et al , 2008). The Diels-Alder reaction is a cycloaddition reaction between a diene (e.g.…”

Section: Introductionmentioning

confidence: 97%