Abstract:Two-dimensional electron gas (2DEG) at the complex oxide interfaces have brought about considerable interest for the application of the next-generation multifunctional oxide electronics due to the exotic properties that do not exist in the bulk. In this study, we report the integration of 2DEG into the nonvolatile resistance switching cell as a bottom electrode, where the metal-insulator transition of 2DEG by an external field serves to significantly reduce the OFF-state leakage current while enhancing the on/… Show more
“…Several VCM RRAM devices have been recently reported, leveraging such 2DEG electrodes. These include Pt/ LaAlO 3 /SrTiO 3 [26], indium tin oxide (ITO)/LaAlO 3 /SrTiO 3 [28], Pt/Ta 2 O 5-y /Ta 2 O 5-x /SrTiO 3 [27], and Pt/Al 2 O 3 /SrTiO 3 [24].…”
Section: Two-dimensional Electron Gases At Oxide Interfaces For Resistive Random-access Memory Applicationsmentioning
confidence: 99%
“…Joung et al [27] reported amorphous TaO x /single crystal SrTiO 3 based VCM. Ta 2 O 5-y (TO2)/Ta 2 O 5-x (TO1) bilayer of TaO x was deposited using PLD at 200 °C under 70-100 mTorr oxygen (TO2) and at 700 °C under 0.5 mTorr oxygen (TO1).…”
Section: Two-dimensional Electron Gases At Oxide Interfaces For Resistive Random-access Memory Applicationsmentioning
confidence: 99%
“…These oxide interfaces provided a fertile ground for the discovery and manipulation of extraordinary physics, such as superconductivity [2][3][4][5], magnetism [6,7], magnetoelectric coupling [8,9], Rashba spinorbit coupling [10], persistent photoconductivity [11,12], and integer/fractional quantum Hall effect [13,14]. Over the last decade, leveraging these phenomena towards various devices, such as transistors [15][16][17][18][19], diodes [20], gas sensors [21], spintronic devices [22,23], and memory devices [24][25][26][27][28][29], has drawn considerable attention. In addition to the exotic phenomena listed above, the emergence of a high sheet density of electrons (typically 10 12 ∼10 15 cm −2 ) between two insulators is already attractive for some devices, such as in the role of channels or back electrodes.…”
Section: Introductionmentioning
confidence: 99%
“…Among their various device prospects, recently, 2DEGs were utilized for resistive random-access memories (RRAMs) [24][25][26][27][28]. RRAM devices [34][35][36] are highly attractive for the nextgeneration memories [37,38] and new computing paradigms [39][40][41][42][43][44][45][46].…”
Two-dimensional electron gases (2DEGs) can be formed at some oxide interfaces, providing a fertile ground for creating extraordinary physical properties. These properties can be exploited in various novel electronic devices such as transistors, gas sensors, and spintronic devices. Recently several works have demonstrated the application of 2DEGs for resistive random-access memories (RRAMs). We briefly review the basics of oxide 2DEGs, emphasizing scalability and maturity and describing a recent trend of progression from epitaxial oxide interfaces (such as LaAlO3/SrTiO3) to simple and highly scalable amorphous-polycrystalline systems (e.g., Al2O3/TiO2). We critically describe and compare recent RRAM devices based on these systems and highlight the possible advantages and potential of 2DEGs systems for RRAM applications. We consider the immediate challenges to revolve around scaling from one device to large arrays, where further progress with series resistance reduction and fabrication techniques needs to be made. We conclude by laying out some of the opportunities presented by 2DEGs based RRAM, including increased tunability and design flexibility, which could, in turn, provide advantages for multi-level capabilities.
“…Several VCM RRAM devices have been recently reported, leveraging such 2DEG electrodes. These include Pt/ LaAlO 3 /SrTiO 3 [26], indium tin oxide (ITO)/LaAlO 3 /SrTiO 3 [28], Pt/Ta 2 O 5-y /Ta 2 O 5-x /SrTiO 3 [27], and Pt/Al 2 O 3 /SrTiO 3 [24].…”
Section: Two-dimensional Electron Gases At Oxide Interfaces For Resistive Random-access Memory Applicationsmentioning
confidence: 99%
“…Joung et al [27] reported amorphous TaO x /single crystal SrTiO 3 based VCM. Ta 2 O 5-y (TO2)/Ta 2 O 5-x (TO1) bilayer of TaO x was deposited using PLD at 200 °C under 70-100 mTorr oxygen (TO2) and at 700 °C under 0.5 mTorr oxygen (TO1).…”
Section: Two-dimensional Electron Gases At Oxide Interfaces For Resistive Random-access Memory Applicationsmentioning
confidence: 99%
“…These oxide interfaces provided a fertile ground for the discovery and manipulation of extraordinary physics, such as superconductivity [2][3][4][5], magnetism [6,7], magnetoelectric coupling [8,9], Rashba spinorbit coupling [10], persistent photoconductivity [11,12], and integer/fractional quantum Hall effect [13,14]. Over the last decade, leveraging these phenomena towards various devices, such as transistors [15][16][17][18][19], diodes [20], gas sensors [21], spintronic devices [22,23], and memory devices [24][25][26][27][28][29], has drawn considerable attention. In addition to the exotic phenomena listed above, the emergence of a high sheet density of electrons (typically 10 12 ∼10 15 cm −2 ) between two insulators is already attractive for some devices, such as in the role of channels or back electrodes.…”
Section: Introductionmentioning
confidence: 99%
“…Among their various device prospects, recently, 2DEGs were utilized for resistive random-access memories (RRAMs) [24][25][26][27][28]. RRAM devices [34][35][36] are highly attractive for the nextgeneration memories [37,38] and new computing paradigms [39][40][41][42][43][44][45][46].…”
Two-dimensional electron gases (2DEGs) can be formed at some oxide interfaces, providing a fertile ground for creating extraordinary physical properties. These properties can be exploited in various novel electronic devices such as transistors, gas sensors, and spintronic devices. Recently several works have demonstrated the application of 2DEGs for resistive random-access memories (RRAMs). We briefly review the basics of oxide 2DEGs, emphasizing scalability and maturity and describing a recent trend of progression from epitaxial oxide interfaces (such as LaAlO3/SrTiO3) to simple and highly scalable amorphous-polycrystalline systems (e.g., Al2O3/TiO2). We critically describe and compare recent RRAM devices based on these systems and highlight the possible advantages and potential of 2DEGs systems for RRAM applications. We consider the immediate challenges to revolve around scaling from one device to large arrays, where further progress with series resistance reduction and fabrication techniques needs to be made. We conclude by laying out some of the opportunities presented by 2DEGs based RRAM, including increased tunability and design flexibility, which could, in turn, provide advantages for multi-level capabilities.
“…Seok et al reported that trimethylaluminum (TMA), an Al precursor, creates V o and electrons by reducing the TiO 2 layer, resulting in the formation of 2DEG . This laterally conducting layer formed at the Al 2 O 3 /TiO 2 interface can be interpreted as an n-type semiconductor, where V o serves as a donor, and several researchers have proposed methods to harness this 2DEG as a V o reservoir for RRAM. − Thus, a more compact, scaled S-RRAM can be constructed by establishing a vertical 2DEG and employing it as an electrode and controlling the V o concentration within the RRAM layer via thermal migration from the 2DEG through a minimized active switching region.…”
In recent years, many studies have focused on addressing the switching variability of filamentary switching resistive random access memory (F-RRAM). This problem persists owing to the inherent unpredictability in the formation and rupture of filaments during the resistive switching process. In this study, we developed a method for using space charge limited current (SCLC) switching-based RRAM (S-RRAM) in a highly scaled cell area by revealing the changes in the switching mechanism of TiO 2 -based RRAM based on the oxygen vacancy (V o ) concentration. Experimental results revealed that the vertically oriented two-dimensional (2D) electron gas (V-2DEG) electrode significantly minimized the device cell area to 300 nm 2 . This, in turn, facilitated a precise manipulation of the V o concentration in TiO 2 via thermal migration of V o during the annealing phase. Consequently, an S-RRAM with excellent switching characteristics was implemented under the condition of rapid thermal annealing (RTA) at 300 °C for 1 min. The S-RRAM device, driven by electron trapping and detrapping at the V o trap site, exhibited outstanding switching uniformity, a reduced operating voltage (<1 V), and a substantial on/off ratio (>40). The impressive switching performance and area scalability of the S-RRAM afforded by the V o concentration-controllable V-2DEG electrode configuration hold significant potential for future high-density nonvolatile memory applications.
Resistive switching devices herald a transformative technology for memory and computation, offering considerable advantages in performance and energy efficiency. Here, a simple and scalable material system of conductive oxide interfaces is employed, and their unique properties are leveraged for a new type of resistive switching device. An Al2O3–TiO2‐based valence‐change resistive switching device, where the conductive oxide interface serves both as the bottom electrode and as a reservoir of defects for switching, is demonstrated. The amorphous–polycrystalline Al2O3–TiO2 conductive interface is obtained following the technological path of simplifying the fabrication of the 2D electron gases (2DEGs), making them scalable for practical mass integration. Physical analysis of the device chemistry and microstructure with comprehensive electrical analysis of its switching behavior and performance is combined. The origin of the resistive switching is pinpointed to the conductive oxide interface, which serves both as the bottom electrode and as a reservoir of oxygen vacancies. The latter plays a key role in valence‐change resistive switching devices. The new device, based on scalable and complementary metal–oxide–semiconductor (CMOS)‐technology‐compatible fabrication processes, opens new design spaces toward increased tunability and simplification of the device selection challenge.
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