Abstract:Insulated gate bipolar transistor (IGBT) is widely used in power equipment, it generally works in complex circuit profiles and it is very difficult to measure or predict the thermal parameters of the module in real-time and evaluate the corresponding health status in the transient process. This paper develops a novel approach for solder-layer condition monitoring of IGBTs. In the approach a time-series nonparametric model of a power module is constructed, the current power and ambient temperature data are used… Show more
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