2013
DOI: 10.1115/1.4025300
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Nonlocal Modeling and Swarm-Based Design of Heat Sinks

Abstract: Cooling electronic chips to satisfy the ever-increasing heat transfer demands of the electronics industry is a perpetual challenge. One approach to addressing this is through improving the heat rejection ability of air-cooled heat sinks, and nonlocal thermal-fluid-solid modeling based on Volume Averaging Thoery (VAT) has allowed for significant strides in this effort. A number of optimization methods for heat sink designers who model heat sinks with VAT can be envisioned due to VAT's singular ability to rapidl… Show more

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Cited by 2 publications
(1 citation statement)
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“…Although various advanced cooling systems have been suggested (e.g., thermoelectric cooling, liquid cooling, two-phase cooling, etc.) [2][3][4], the solution with air-cooled heat sinks is preferred because of its reliability and cost-effectiveness [5]. To enhance the rate of heat dissipation from an air-cooled heat sink, the simple approach is to increase heat sink size or the air flow rate.…”
Section: Introductionmentioning
confidence: 99%
“…Although various advanced cooling systems have been suggested (e.g., thermoelectric cooling, liquid cooling, two-phase cooling, etc.) [2][3][4], the solution with air-cooled heat sinks is preferred because of its reliability and cost-effectiveness [5]. To enhance the rate of heat dissipation from an air-cooled heat sink, the simple approach is to increase heat sink size or the air flow rate.…”
Section: Introductionmentioning
confidence: 99%