Nonlinear Electrothermal Model for Investigating Transient Temperature Responses of a Through-Silicon Via Array Applied With Gaussian Pulses in 3-D IC

Chai, Jingrui; Dong, Gang; Yang, Yintang

doi:10.1109/ted.2018.2888870

Cited by 12 publications

(3 citation statements)

References 21 publications

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“…For temporal discretization, several numerical methods have been used for the transient thermal analysis of 3-D ICs [26], [27]. Among them, the typical explicit time methods include: forward Euler method [19] and leapfrog method [23].…”

Section: Introductionmentioning

confidence: 99%

The Domain Decomposition Method With Adaptive Time Step for the Transient Thermal Analysis of 3-D ICs

et al. 2023

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With the continuous emergence of various advanced packaging technologies such as copper interconnection and 3-D packaging technology, it is essential to efficiently and accurately investigate the thermal analysis of high-performance, high-power and complicated electronic devices to better design heat dissipation structures. However, multiscale transient thermal analysis of complex electronic devices by existing numerical methods is still a challenge. In this work, the 3-D domain decomposition method (DDM) with the adaptive time step for the transient thermal analysis of integrated circuits (ICs) is proposed to tackle this problem. By flexible multiscale mesh generation and automatically time step changes based on posteriori errors, the new method significantly improves computational efficiency. Some illustrative numerical examples are presented to verify the accuracy and efficiency of the proposed method by considering 3-D transient heat transfer with thermal conduction, natural convection and radiation boundaries.INDEX TERMS Thermal analysis, integrated circuits (ICs), domain decomposition method (DDM), adaptive time step.

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Section: Introductionmentioning

confidence: 99%

The Domain Decomposition Method With Adaptive Time Step for the Transient Thermal Analysis of 3-D ICs

et al. 2023

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“…With the increase of the integration of the electronic components, Joule heat of the circuits becomes a severe problem; sometimes, it will lead to the decline of the reliability of the circuit [1,2]. In order to solve this problem, the variation of the electromagnetic component parameters with the temperature [1][2][3][4], the distribution of the temperature in the circuit [5][6][7], and the influence of the high temperature on circuit performance [1,2,8] arouse the researchers' study interests to guide circuit design and improve its stability. The difficulty of this study is that the electricity is the cause of the Joule heat, and the heat will affect the electrical parameters in return.…”

Section: Introductionmentioning

confidence: 99%

“…In 2019, a 3D RPIM was presented to study the temperature response from a through-silicon via (TSV). And the effects of the σ , K, and the specific heat C were taken into account [7]. Whereas, the problem of meshless algorithm, which we mentioned earlier, still needs to be faced.…”

Section: Introductionmentioning

confidence: 99%

A Difference Subgridding Method for Solving Multiscale Electro-Thermal Problems

2022

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Because of less memory costs and time consumption, a finite difference subgrid technique can effectively deal with multiscale problems in electromagnetic fields. When used in Maxwell equation, symmetric elements of the matrix are required; otherwise, the algorithm will be unstable. Usually, the electro-thermal problem also contains multiscale structures. However, the coefficient matrix of the heat transfer equation is asymmetric because the parameters of the equation vary with temperature and the Robbin boundary condition is used as well. In this paper, a three-dimensional (3D) finite difference subgridding method is proposed to simulate the electro-thermal coupling process of the multiscale circuits. The stability condition of the algorithm is deduced with a matrix method. And the efficiency and the effectiveness of the proposed subgridding approach are verified through square- and n-shaped resistances. Compared with the results of the COMSOL software and the traditional finite difference method (FDM), the proposed subgridding method has less unknowns and faster speed.

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Investigation of heat transfer performance for through-silicon via embedded in micro pin fins in 3D integrated chips

Wang

et al. 2023

International Journal of Heat and Mass Transfer

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Nonlinear Electrothermal Model for Investigating Transient Temperature Responses of a Through-Silicon Via Array Applied With Gaussian Pulses in 3-D IC

Cited by 12 publications

References 21 publications

The Domain Decomposition Method With Adaptive Time Step for the Transient Thermal Analysis of 3-D ICs

The Domain Decomposition Method With Adaptive Time Step for the Transient Thermal Analysis of 3-D ICs

A Difference Subgridding Method for Solving Multiscale Electro-Thermal Problems

Investigation of heat transfer performance for through-silicon via embedded in micro pin fins in 3D integrated chips

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