2008
DOI: 10.1080/10589750701775700
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Nondestructive measurement of bond line thickness and die tilt in the die attach for semiconductor packaging

Abstract: 2008) Nondestructive measurement of bond line thickness and die tilt in the die attach for semiconductor packaging, Nondestructive Testing and Evaluation, 23:2, 89-98,The present investigation describes about the development of a cost effective measurement technique for automatic determination of bond-line thickness and die tilt in die attach for semiconductor packaging process. Bond line thickness (BLT) and die tilt in the die attach were measured using an optical non contact scanning probe system. The probe … Show more

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Cited by 8 publications
(3 citation statements)
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“…This suggests a new way for highly accurate wafer alignment. The method is much more efficient than point-to-point or scanning probe-based techniques [33]. Fig.…”
Section: Ultra-sensitive and Robust Nanopattern Surface Tilting Sensormentioning
confidence: 99%
“…This suggests a new way for highly accurate wafer alignment. The method is much more efficient than point-to-point or scanning probe-based techniques [33]. Fig.…”
Section: Ultra-sensitive and Robust Nanopattern Surface Tilting Sensormentioning
confidence: 99%
“…For example, the die tilt in LED packaging results in the poor optical performance of high-power LEDs [9]. In order to pick out electronic devices with die tilt in mass packaging, many measurement technologies have been developed [10]. However, the die tilt measurement is not the most ideal solution in view of the cost reduction and manufacture efficiency for electronic packaging.…”
Section: Introductionmentioning
confidence: 99%
“…The optical methods for 3D surface measurement have been extensively studied and played an increasingly important role for various applications, such as industrial inspection, object recognition, virtual reality, biometrics, and reverse engineering [1]. Techniques include stereo-vision [2], laser scanning [3], structured light [4], and phase shifting [5] were usually adopted in these measurements. Among all these techniques, stereo vision has become a most popular method and been applied in many domains [5,6], due to its advantages of low cost, good reliability, easy maintenance and operated under natural environment characteristics.…”
Section: Introductionmentioning
confidence: 99%