Nondestructive measurement of bond line thickness and die tilt in the die attach for semiconductor packaging

Chang, Ming; Deka, Juti Rani; Tseng, Kai-Ming

doi:10.1080/10589750701775700

Cited by 8 publications

(3 citation statements)

References 3 publications

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“…This suggests a new way for highly accurate wafer alignment. The method is much more efficient than point-to-point or scanning probe-based techniques [33]. Fig.…”

Section: Ultra-sensitive and Robust Nanopattern Surface Tilting Sensormentioning

confidence: 99%

Regularized pseudo-phase imaging for inspecting and sensing nanoscale features

et al. 2019

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Recovering tiny nanoscale features using a general optical imaging system is challenging because of poor signal to noise ratio. Rayleigh scattering implies that the detectable signal of an object of size d illuminated by light of wavelength λ is proportional to d 6 /λ 4 , which may be several orders of magnitude weaker than that of additive and multiplicative perturbations in the background. In this article, we solve this fundamental issue by introducing the regularized pseudo-phase, an observation quantity for polychromatic visible light microscopy that seems to be more sensitive than conventional intensity images for characterizing nanoscale features. We achieve a significant improvement in signal to noise ratio without making any changes to the imaging hardware. In addition, this framework not only retains the advantages of conventional denoising techniques, but also endows this new measurand (i.e., the pseudo-phase) with an explicit physical meaning analogous to optical phase. Experiments on a NIST reference material 8820 sample demonstrate that we can measure nanoscale defects, minute amounts of tilt in patterned samples, and severely noisepolluted nanostructure profiles with the pseudo-phase framework even when using a low-cost bright-field microscope.

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“…This suggests a new way for highly accurate wafer alignment. The method is much more efficient than point-to-point or scanning probe-based techniques [33]. Fig.…”

Section: Ultra-sensitive and Robust Nanopattern Surface Tilting Sensormentioning

confidence: 99%

Regularized pseudo-phase imaging for inspecting and sensing nanoscale features

et al. 2019

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“…For example, the die tilt in LED packaging results in the poor optical performance of high-power LEDs [9]. In order to pick out electronic devices with die tilt in mass packaging, many measurement technologies have been developed [10]. However, the die tilt measurement is not the most ideal solution in view of the cost reduction and manufacture efficiency for electronic packaging.…”

Section: Introductionmentioning

confidence: 99%

Effect of die shape on die tilt in die attach process

Zheng

Wang

Luo

et al. 2013

2013 14th International Conference on Electronic Packaging Technology

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Die attach process is widely used to realize the connection between die, device and the rest of the system in electronic packaging. During this process, the die moves under the capillary force induced by the liquidus solder. Such a die tilt phenomenon usually occurs and strongly worsens the reliability and performances of devices. In this paper, we built a numerical model based on fluid minimal free energy theory for analyzing the die arrangement in die attach process. By this model, die arrangements of three kinds of die shapes in terms of square, square with round corner and circle were calculated. Results indicate that compared to the square, both square with round corner and circle benefit preventing the die tilt. Especially, the circle die can well keep the parallel die arrangement.

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“…The optical methods for 3D surface measurement have been extensively studied and played an increasingly important role for various applications, such as industrial inspection, object recognition, virtual reality, biometrics, and reverse engineering [1]. Techniques include stereo-vision [2], laser scanning [3], structured light [4], and phase shifting [5] were usually adopted in these measurements. Among all these techniques, stereo vision has become a most popular method and been applied in many domains [5,6], due to its advantages of low cost, good reliability, easy maintenance and operated under natural environment characteristics.…”

Section: Introductionmentioning

confidence: 99%

Complex Freeform Surface Measurement Based on Stereo Vision and Digital Phase-Shifting Techniques

Lin

Jiang

Chang

et al. 2013

AMM

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In this paper, a method combining stereo vision and digital phase-shifting techniques is presented, which can measure the profile of complex freeform surfaces expeditiously and accurately. A chessboard is used to determine the camera parameters for the camera calibration of the system and the epipolar line rectification is executed based on the stereo calibration result. The stereo matching is processed with the combination of four-step phase-shifting and Gray code techniques, and the maximum probability method is proposed to remove the fringe order confusion problem between Gray code and phase shifting measurement. Bilinear interpolation method is also adopted to improve the speed and accuracy of stereo matching. Experiments were carried out with measuring a step gauge block and a shoe last model. Experimental results show that the measurement can be completed within 3 s for a measuring region of 640 mm × 480 mm, and the average measurement error is less than 0.054 mm.

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Nondestructive measurement of bond line thickness and die tilt in the die attach for semiconductor packaging

Cited by 8 publications

References 3 publications

Regularized pseudo-phase imaging for inspecting and sensing nanoscale features

Regularized pseudo-phase imaging for inspecting and sensing nanoscale features

Effect of die shape on die tilt in die attach process

Complex Freeform Surface Measurement Based on Stereo Vision and Digital Phase-Shifting Techniques

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