Non-thermal ablation and deposition of graphite induced by ultrashort pulsed laser radiation

Kalupka, Christian; Reininghaus, Martin; Faley, O.

doi:10.1364/cleo_si.2015.sth4m.4

Cited by 3 publications

(4 citation statements)

References 7 publications

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“…The laser marking parameters are summarized in Table 1 (left). [1] USP laser source, [2] beam expander, [3] autocorrelator, [4] 𝜆 2 ⁄ plate, [5] polarizing beam splitter, [6] 𝜆 4 ⁄ plate, [7] microscanner, [8] objective, [9] sample holder, [10] xy<axis, [11] confocal camera, [12] z-axis.…”

Section: Setup and Methodsmentioning

confidence: 99%

“…In a first step, the contour of the arbitrary 3D geometry to be fabricated is structured in the bulk of the glass by tightly focused USP laser radiation. The energy of the photons of the pulse is transferred to the electrons via non-linear absorption effects due to the high intensities (> 10 12 W cm 2 ⁄ ) 6 . The energy of the electrons is transferred to the atoms by scattering leading to mechanical defects in form of nanogratings 7 and reorientation of the atomic structure 8 .…”

Section: Introductionmentioning

confidence: 99%

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Processing of thin, curved borosilicate glass with selective laser-induced etching

Kratz,

Köller,

Theis

et al. 2024

Laser-Based Micro- And Nanoprocessing XVIII

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Modification of glass with ultrashort pulsed (USP) laser radiation with subsequent wet chemical etching is a well-known process, especially for fused silica, and is referred to as selective laser induced etching (SLE). The main advantage of the SLE process is that almost any 3D geometry can be produced, but currently this is mainly limited to the use of fused silica samples with flat surfaces. To extend the SLE process, we have now processed 400 µm thick upward curved borosilicate glass. In the initial studies on planar borosilicate glass, the first process parameters are found and partially transferred to the curved samples. However, it is found that etching of simple structures occurs at different rates when comparing planar and curved material. This presents a challenge for processing curved surfaces, where optical aberrations like spherical aberrations, astigmatism, and coma distort the spot geometry. We are able to spiral cut the curved 400 µm thick borosilicate glass sample as well as drill through it using the SLE process. Difficulties are observed in the structuring of the area with high incident angles at greater radii, since here the influence of optical aberrations becomes dominant. Thus, sufficient modification by the laser radiation is no longer possible. This prevents the subsequent etching process. This allows the limits of the SLE process to be evaluated for thin upward curved borosilicate glass. The spiral created from the curved glass shows high flexibility and therefore the high durability of the material after processing.

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Section: Setup and Methodsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Processing of thin, curved borosilicate glass with selective laser-induced etching

Kratz,

Köller,

Theis

et al. 2024

Laser-Based Micro- And Nanoprocessing XVIII

View full text Add to dashboard Cite

show abstract

“…In the SLE process ultra-short pulsed (USP) laser radiation is utilized to modify dielectric transparent materials. By tightly focusing the USP laser radiation into the volume, the energy of the photons is deposited in the material via non-linear absorption effects due to the high intensities (> 10 12 W cm 2 ⁄ ) 21,22 . Depending on the laser writing parameters like pulse energy, pulse duration, pulse repetition rate and feed velocity, the modification leads to an increased etch rate against certain etchants compared to the pristine material 23,24 .…”

Section: Introductionmentioning

confidence: 99%

Selective laser-induced etching for novel 3D microphotonic devices

Beckmann,

Bi,

Thoms

et al. 2024

Laser-Based Micro- And Nanoprocessing XVIII

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In this work, we evaluate the advantages and limitations of the Selective Laser-induced Etching (SLE) process for the fabrication of novel three-dimensional microresonator structures. Microresonators are resonant optical structures with the ability to store light of a specific wavelength. They are used as non-linear optical components, in sensors or even in integrated photonic devices. These structures are characterized by the optical quality factor Q as a measure of the optical storage capabilities. Q is significantly influenced by a high-quality optical surface with low surface roughness. In addition to surface quality and small dimensions, from tens of microns to millimeters, high optical nonlinearity is a key requirement in these fields. The fabrication of 3D fused silica parts fulfilling these requirements is an ongoing challenge in the field of microfabrication in quantum technology. The SLE process is used to fabricate three-dimensional parts of transparent materials such as fused silica with a high degree of geometric freedom in a two-step process. In the first step, a model of the part is written into the material using ultrashort pulse (USP) laser radiation. In the second step, the laser-written shape is wet-chemically etched in aqueous KOH to expose the part. The fabrication of 2D disk microresonators with high Qfactors is evaluated by studying the surface roughness of the SLE process followed by polishing. The polished samples are characterized and Q-factors >10 7 are achieved. In addition, the extent to which dimensions and geometry differ between design and real SLE components is analyzed. The SLE process will thus be investigated as a possible process for the future fabrication of three-dimensional microresonators.

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“…Ultrashort pulsed (USP) laser radiation enables the processing of most classes of solid materials with micrometer precision and negligible thermal load. By tight focusing, USP laser radiation can reach peak intensities > 10 13 W/cm 2 in the focal spot exceeding the ionization threshold of transparent dielectrics [1][2][3] . Hence, the almost thermal-free processing of such materials is possible on the surface as well as in volume of a bulk.…”

Section: Introductionmentioning

confidence: 99%

Selective laser-induced etching for 3D ion traps

Simeth¹,

Muller

Müller

et al. 2023

Laser-Based Micro- And Nanoprocessing XVII

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Selective Laser-induced Etching (SLE) is a manufacturing process which enables the fabrication of three-dimensional parts from transparent materials with unique freedom of geometry and high precision. First, the outer contour of the part is inscribed in the material using focused ultrashort pulsed laser radiation. Second, the modified design is exposed from the bulk material using wet chemical etching. We analyze the possibility of using SLE for the machining of next generation fused silica ion traps suitable for quantum computing. Such ion traps require an enhanced functionality in combination with reduced error sources and a reproducible manufacturing process. Ion trap designs with three-dimensional features in the micrometer regime are developed to meet these requirements. Challenges of the SLE process arising from the ion trap design and its dimensions are discussed. Different process strategies to fabricate single ion trap components as well as complete ion traps are examined. We demonstrate that next generation ion traps can be machined using SLE and outline the way towards a fabrication on wafer level.

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Non-thermal ablation and deposition of graphite induced by ultrashort pulsed laser radiation

Cited by 3 publications

References 7 publications

Processing of thin, curved borosilicate glass with selective laser-induced etching

Processing of thin, curved borosilicate glass with selective laser-induced etching

Selective laser-induced etching for novel 3D microphotonic devices

Selective laser-induced etching for 3D ion traps

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