Non‐Porous Low‐<i>k</i> Dielectric Films Based on a New Structural Amorphous Fluoropolymer

Yuan, Chao; Jin, Kaikai; Li, Kai; Diao, Shen; Jin, Tao; Fang, Qiang

doi:10.1002/adma.201302021

Cited by 167 publications

(153 citation statements)

References 30 publications

Supporting

Mentioning

144

Contrasting

Order By: Relevance

“…21,22 Furthermore, the existence of uorinate and stiff non-polar structure can also decrease moisture absorption and improve the thermal stability of materials. 23 Sasaki 24 reported that the bisphenol A type epoxy resin cured with uorinated phthalic anhydride had the lowest dielectric constant (2.77) and dielectric loss factor (0.01) among all cured epoxy resins.…”

Section: -9mentioning

confidence: 99%

Preparation and characterization of novel naphthyl epoxy resin containing 4-fluorobenzoyl side chains for low-k dielectrics application

Jiang

Zhao

et al. 2017

RSC Adv.

View full text Add to dashboard Cite

A new type of epoxy monomer 1,5-bis(4-fluorobenzoyl)-2,6-diglycidyl ether naphthalene (DGENF) was obtained through a three-step procedure involving Friedel-Crafts acylation, demethylation, and followed by nucleophilic reaction. The chemical structures were confirmed by 1 HNMR, 19 FNMR and FT-IR. After curing with methylhexahydrophthalic anhydride (MeHHPA), the properties of DGENF epoxy resin were measured and compared with three other kinds of commercial epoxy resins. As a result, DGENF exhibited excellent thermal stability, hydrophobic and dielectric properties. For example, DGENF had a higher glass transition temperature of 170 C than the other three commercial epoxy resins. DGENF showed a higher contact angle of 116 , which could satisfy the standard of hydrophobic materials. In addition, DGENF showed significantly lower dielectric constant (2.97 at 1 MHz) and dielectric loss (0.0188 at 1 MHz) than those of the other commercial epoxy resins because of the introduction of fluorine on the side chains, which improved the electronegativity of the epoxy resin and reduced the polarizability of molecules efficiently. Herein, we believe the novel naphthyl epoxy resin (DGENF) has demonstrated potential application in electronic industries.

show abstract

Section: -9mentioning

confidence: 99%

Preparation and characterization of novel naphthyl epoxy resin containing 4-fluorobenzoyl side chains for low-k dielectrics application

Jiang

Zhao

et al. 2017

RSC Adv.

View full text Add to dashboard Cite

show abstract

“…The dielectric constants of the cured fluorinated benzoxazines P1 and P2 were measured by the capacitance method at various frequencies, which has high-accuracy measurements. 52 The parallel plate capacitors were fabricated on goldcoated glass slides by spin-coating a solution of the appropriate monomer in THF. The resulting slides were cured via the optimized curing profiles.…”

Section: ■ Experimental Sectionmentioning

confidence: 99%

Synthesis and Characterization of Partially Fluorinated Polybenzoxazine Resins Utilizing Octafluorocyclopentene as a Versatile Building Block

Wu¹,

Yang²,

McCandless³

et al. 2015

Macromolecules

102

View full text Add to dashboard Cite

Two new fluorinated diamine-based benzoxazines using octafluorocyclopentene (OFCP) as a building block have been developed. Monomers were synthesized via two distinct synthetic procedures utilizing the facile nucleophilic addition−elimination reaction of OFCP with phenols amenable to a multigram scale-up. The structure elucidation of both monomers was confirmed by 1 H, 19 F, and 13 C NMR, ATR-FTIR, and high-resolution mass spectrometry. Benzoxazine networks were prepared by a thermally mediated ring-opening polymerization. ATR-FTIR analysis was utilized to monitor the ring-opening reaction of the monomers. The resulting two cured resins exhibit the combined excellent properties of low dielectric constants (k = 3.2−2.6), excellent thermal stability, and high char yields which are suitable for many applications such as flame-resistant materials as well as aerospace and microelectronic industries.

show abstract

“…In the last few decades, various low k materials [1][2][3][4][5][6][7][8][9] including silicates, polyimides, benzoxazine, SiLK, or benzocyclobutene have been developed, whereas commercially available low k materials with low cost are rare. The application of new low dielectric constant polymers will enable the development of future generations of lower cost and higher performance integrated circuits (ICs).…”

Section: Introductionmentioning

confidence: 99%

Adamantyl-based benzocyclobutene low-k polymers with good physical properties and excellent planarity

et al. 2015

View full text Add to dashboard Cite

Low dielectric polymers play an important role in replacing traditional inorganic dielectric materials in advanced electronic manufacturing due to their excellent physical and chemical properties. Herein we report the preparation and characterization of two novel low-k dielectric polymers by introducing adamantane into benzocyclobutene. Because the adamantyl group has low polarizability and can increase the free volume of the polymer, both polymers showed low dielectric constants (2.5) and low dielectric loss (o0.001) at the frequency within 10 KHz-5 MHz. They also showed excellent film uniformity and planarity with the surface roughness less than 0.6 nm and good hydrophobicity with the contact angle larger than 1071. Due to the high cross-linked network structure, both of the adamantylbased BCB polymers exhibited high glass transition temperature (4350 1C), high storage modulus and good thermal stability (T d 4 400 1C in nitrogen). Especially, the p-Ada-TVS-BCB polymer showed a low coefficient of thermal expansion (41 mm m À1 1C À1 ). All of these good properties are in accord with the requirement of the interconnect fabrication of Cu metallization using the damascene process. Both of the polymers are suitable for the utilization in the electronic packing industry.

show abstract

Non‐Porous Low‐k Dielectric Films Based on a New Structural Amorphous Fluoropolymer

Cited by 167 publications

References 30 publications

Preparation and characterization of novel naphthyl epoxy resin containing 4-fluorobenzoyl side chains for low-k dielectrics application

Preparation and characterization of novel naphthyl epoxy resin containing 4-fluorobenzoyl side chains for low-k dielectrics application

Synthesis and Characterization of Partially Fluorinated Polybenzoxazine Resins Utilizing Octafluorocyclopentene as a Versatile Building Block

Adamantyl-based benzocyclobutene low-k polymers with good physical properties and excellent planarity

Contact Info

Product

Resources

About