Non-linear Compensated Dwell Time for Efficient Fused Silica Surface Figuring Using Inductively Coupled Plasma

Dai, Zuocai; Xie, Xuhui; Chen, Heng; Zhou, Lin

doi:10.1007/s11090-018-9873-7

Cited by 24 publications

(6 citation statements)

References 15 publications

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“…Researchers are now broadening the capabilities of ICP torches to enable the correction of large ultra-precise optical components. The worldwide demand for ultra-precise surfaces led to the creation of a dwell time surface correction technique using plasma figuring [ 1 ]. The technique is based on the use of a unique ICP torch that is both presented and scrutinized from a thermal viewpoint.…”

Section: Introductionmentioning

confidence: 99%

Power Dissipation of an Inductively Coupled Plasma Torch under E Mode Dominated Regime

Jourdain

Gourma

et al. 2021

Micromachines

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This paper focuses on the power dissipation of a plasma torch used for an optical surface fabrication process. The process utilizes an inductively coupled plasma (ICP) torch that is equipped with a De-Laval nozzle for the delivery of a highly collimated plasma jet. The plasma torch makes use of a self-igniting coil and an intermediate co-axial tube made of alumina. The torch has a distinctive thermal and electrical response compared to regular ICP torches. In this study, the results of the power dissipation investigation reveal the true efficiency of the torch and discern its electrical response. By systematically measuring the coolant parameters (temperature change and flow rate), the power dissipation is extrapolated. The radio frequency power supply is set to 800 W, E mode, throughout the research presented in this study. The analytical results of power dissipation, derived from the experiments, show that 15.4% and 33.3% are dissipated by the nozzle and coil coolant channels, respectively. The experiments also enable the determination of the thermal time constant of the plasma torch for the entire range of RF power.

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Section: Introductionmentioning

confidence: 99%

Power Dissipation of an Inductively Coupled Plasma Torch under E Mode Dominated Regime

Jourdain

Gourma

et al. 2021

Micromachines

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“…The active particles, which are created by pulsed microwave power, react with the solid surface and form volatile compounds, and a local dry etching process takes place . Etching processes have been used so far mostly for silicon, fused silica, SiC, or ULE® using fluorine‐based chemistry, as most of fluoride‐silicon compounds are volatile and material removal is achieved in a predictable manner …”

Section: Introductionmentioning

confidence: 99%

“…[15,16] Etching processes have been used so far mostly for silicon, fused silica, SiC, or ULE ® using fluorine-based chemistry, as most of fluoride-silicon compounds are volatile and material removal is achieved in a predictable manner. [17,18] In this study, we investigate the usage of the PJM technique for borosilicate glass, namely N-BK7® (Edmund Optics company), since this material is even more widely used in optical applications compared to fused silica. However, the application of PJM on this material is not a straightforward approach since N-BK7 contains metal elements such as sodium, barium and potassium, which produce nonvolatile fluorine compounds like BaF 2 , NaF, and KF.…”

mentioning

confidence: 99%

Development of a model for ultra‐precise surface machining of N‐BK7® using microwave‐driven reactive plasma jet machining

Kazemi

Boehm

Arnold

2019

Plasma Processes & Polymers

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In this paper, extensive studies are conducted as key to overcoming several challenging limitations in applying fluorine‐based reactive plasma jet machining (PJM) to surface machining of N‐BK7®, particularly regarding the manufacture of freeform optical elements. The chemical composition and lateral distributions of the residual layer are evaluated by X‐ray photoelectron spectroscopy and scanning electron microscopy/energy‐dispersive X‐ray spectroscopy analysis aiming at clarifying the exact chemical kinetics between plasma generated active particles and the N‐BK7 surface atoms. Subsequently, a model is developed by performing static etchings to consider the time‐varying nonlinearity of the material removal rate and estimate the local etching rate function. Finally, the derived model is extended into the dynamic machining process, and the outcomes are compared with the experimental results.

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“…For the management of heat transfer, an adapted tool-path strategy was combined with an iterative figuring procedure. Due to the high thermal nonlinear effect of inductively coupled plasma, Dai et al [15] developed an algorithm based on the nested pulsed iterative method to compensate for this time-varying non-linearity by varying the dwell time. With the compensated dwell time, the surface error converged from 4.556 λ PV (peak-to-valley) to 0.839 λ PV in one iterative figuring.…”

Section: Introductionmentioning

confidence: 99%

Continuous Phase Plate Structuring by Multi-Aperture Atmospheric Pressure Plasma Processing

et al. 2019

Micromachines

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A multi-aperture atmospheric pressure plasma processing (APPP) method was proposed to structure the continuous phase plate (CPP). The APPP system was presented and removal investigation showed the removal function of APPP was of a high repeatability and robustness to the small disturbance of gas flows. A mathematical model for the multi-aperture structuring process was established and the simulation analysis indicated the advantages of the proposed method in terms of balancing the efficiency and accuracy of the process. The experimental results showed that multi-aperture APPP has the ability to structure a 30 mm × 30 mm CPP with the accuracy of 163.4 nm peak to valley (PV) and 31.7 nm root mean square (RMS).

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Non-linear Compensated Dwell Time for Efficient Fused Silica Surface Figuring Using Inductively Coupled Plasma

Cited by 24 publications

References 15 publications

Power Dissipation of an Inductively Coupled Plasma Torch under E Mode Dominated Regime

Power Dissipation of an Inductively Coupled Plasma Torch under E Mode Dominated Regime

Development of a model for ultra‐precise surface machining of N‐BK7® using microwave‐driven reactive plasma jet machining

Continuous Phase Plate Structuring by Multi-Aperture Atmospheric Pressure Plasma Processing

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