Non-equilibrium copper-based crystalline alloy sheet having ultrahigh strength and good electrical conductivity

Miura, H.; Nishiyama, Nobuyuki; Inoue, Akihisa

doi:10.1016/j.jallcom.2011.01.137

Cited by 2 publications

(3 citation statements)

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“…The production process and resulting properties such as tensile strength or conductivity of the non-equilibrium Cu 93.5 Zr 5.5 Ag 1 alloy sheets has also been described elsewhere [9]. In this study, bending ductility was evaluated using W-shaped bending tool with tip radii of ranging from 0.05 to 0.6 mm [13].…”

Section: Methodsmentioning

confidence: 99%

“…The preparation process and resulting properties such as tensile strength or conductivity of the non-equilibrium Cu-based alloy sheets has also been described elsewhere [9]. The advantage of the designing non-equilibrium alloy using the glass-forming rules [5] is that the fine disordered or diffused structure is easily obtained.…”

Section: Conductive Materials For Electrical Connectors Using Non-equmentioning

confidence: 99%

“…After following additional heavy working process, the structure of various non-equilibrium phases with long-periodic hexagonal structure [6] or nano fibrous structure consisting of fcc-Cu and non-equilibrium Cu 9 Zr 2 phases [7] could be formed. By utilization of such a concept, we have developed novel Cu-based non-equilibrium crystalline alloys with high strength of exceeding 1500 MPa and good electrical conductivity of 30% IACS [8,9]. The developed alloys are expected to be alternative materials to Cu-Be alloys.…”

Section: Introductionmentioning

confidence: 99%

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Glassy Alloy Composite and Non-equilibrium Crystalline Alloy for Information Technology Applications

et al. 2011

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Present progress in developments of glassy alloy composites for bit-patterned-media and non-equilibrium Cu-based alloys for conductive materials of electrical connectors are reviewed.It is proven that the imprinting of the Pd-based glassy alloy thin film is favorable for the formation of nano-structured devices. Detailed imprinted morphologies formed by different imprinting conditions were examined. In addition, technology of large area imprinting up to 2.5 inches area has been successfully developed and it is now available for production. These technological developments will be utilized for next generation bit-patterned-media with high data density. A newly developed non-equilibrium Cu-Zr-Ag alloy was prepared into sheet form by the combination of casting, cold rolling and annealing. The alloy sheet exhibited high tensile strength of exceeding 1500 MPa and good electrical conductivity of 30% IACS. However, bending ductility should be improved for the actual production of connector. Through the several examinations, remaining issues that should be solved are discussed in the framework of industrialization and commercialization. These obtained results suggest that the glassy alloy composite or non-equilibrium alloy designed by the glass-forming rules have a great potential to develop innovative products in the near future.

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Section: Methodsmentioning

confidence: 99%

Section: Conductive Materials For Electrical Connectors Using Non-equmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Glassy Alloy Composite and Non-equilibrium Crystalline Alloy for Information Technology Applications

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Improving the mechanical properties and coefficient of thermal expansion of molybdenum-reinforced copper using powder metallurgy

Ahmadein

Elkady

Mohammed

et al. 2021

Mater. Res. Express

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This paper presents an experimental study of Cu-Mo alloys prepared by powder metallurgy (PM) method. Also, improving the dispersion and wettability of Mo in the Cu matrix was aimed. Mo particles were added by 0.24, 0.48, 0.73 and 0.97% volume fraction to Cu powder. The mixture was mechanically milled by planetary ball mill at a rotational speed of 140 rpm for 24 h under hydrogen atmosphere, with milling ball size of ∼25 times the size of the metal powders. Liquid acetone was utilized as a process control agent (PCA). Paraffin wax (0.5 wt%) was used to decrease the friction with die during the compaction process. The mixture of the blended powder was compacted at ambient temperature under three different pressures (400, 600 and 800 MPa) and then sintered in a vacuum furnace at 1000 °C for 1 h by a heating rate of 5 °C min−1. The microstructure examination showed a homogeneous dispersion of Mo particles within the Cu matrix with no evidence of new phases formation during the sintering process. Also, the relative density of samples has been increased by increasing both of Mo content and the compaction pressure. The results revealed that the compaction pressure of 600 MPa was the most suitable pressure as it gave the highest densification. Cu—0.97% volume fraction Mo alloy samples exhibited finer Mo particles with a homogenous distribution in the Cu matrix and well bonding with the Cu particles. The microhardness was increased gradually by increasing Mo wt%, while the compressive strength was decreased by increasing the Mo contents. Both the electrical and thermal conductivities were decreased gradually by the addition of Mo. While the coefficient of thermal expansion (CTE) was decreased by Mo addition.

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Non-equilibrium copper-based crystalline alloy sheet having ultrahigh strength and good electrical conductivity

Cited by 2 publications

References 12 publications

Glassy Alloy Composite and Non-equilibrium Crystalline Alloy for Information Technology Applications

Glassy Alloy Composite and Non-equilibrium Crystalline Alloy for Information Technology Applications

Improving the mechanical properties and coefficient of thermal expansion of molybdenum-reinforced copper using powder metallurgy

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