This paper presents the development of the Thermal Loop experiment under NASA's New Millennium Program Space Technology 8 (ST8) Project. The Thermal Loop experiment was originally planned for validating in space an advanced heat transport system consisting of a miniature loop heat pipe (MLHP) with multiple evaporators and multiple condensers. Details of the thermal loop concept, technical advances and benefits, Level 1 requirements and the technology validation approach are described. An MLHP breadboard has been built and tested in the laboratory and thermal vacuum environments, and has demonstrated excellent performance that met or exceeded the design requirements. The MLHP retains all features of state-of-the-art loop heat pipes and offers additional advantages to enhance the functionality, performance, versatility, and reliability of the system. In addition, an analytical model has been developed to simulate the steady state and transient operation of the MHLP, and the model predictions agreed very well with experimental results. A protoflight MLHP has been built and is being tested in a thermal vacuum chamber to validate its performance and technical readiness for a flight experiment.
Nomenclature
QHigh= highest power to the evaporator while maintaining the compensation chamber temperature at TsE, QLoM = lowest power to the evaporator while maintaining the compensation chamber temperature at T, , GET = compensation chamber set point temperature