Non-Destructive Quantification of In-Plane Depth Distribution of Sub-Surface Damage on 4H-SiC Wafers Using Laser Light Scattering
Daichi Dojima,
Koki Shigematsu,
Kaito Tayake
et al.
Abstract:The development of non-destructive quantitative evaluation techniques for the in-plane depth distribution of sub-surface damage (SSD) layer induced by mechanical processing of chemical mechanical polishing (CMP) finished SiC wafers is essential to reduce the occurrence of crystal defects during epitaxial growth. Until now, no wafer inspection method has been able to nondestructively and quantitatively assess the in-plane depth distribution of the SSD. This study investigates the correlation between the scatter… Show more
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