Non-destructive pulsed field CuAg-solenoids

Freudenberger, J.; Lyubimova, J.; Gaganov, A.; Witte, Holger; Hickman, A.L.; Jones, H.; Nganbe, Michel

doi:10.1016/j.msea.2009.11.038

Cited by 49 publications

(15 citation statements)

References 45 publications

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“…The microhardness and the ultimate tensile strength (UTS), shown in Table 1 , were decreased with increasing ELS. This was attributed to the Hall-Petch relationship between the microhardness and the characteristic microstructure, indicating that the increasing characteristic spacing decreased the strength [ 32 ]. The variations of the microhardness with the interlamellar spacing at a constant temperature gradient ( G = 4 K/mm) are shown in Figure 4 b.…”

Section: Resultsmentioning

confidence: 99%

“…Microstructure analysis ( Figure 2 ) shows that the ELS decreases with decreasing growth rate, and, by increasing MF. Microhardness is increased with decreasing growth rate and by increasing MF according to Hall-Petch equation [ 32 ]. However, Figure 4 a shows that the electrical conductivity of Ag-Cu alloys increases gradually with increasing ELS.…”

Section: Resultsmentioning

confidence: 99%

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Influence of Growth Rate and Magnetic Field on Microstructure and Properties of Directionally Solidified Ag-Cu Eutectic Alloy

et al. 2016

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We report the influence of growth rate and external magnetic field on the eutectic lamellar spacing and properties of directionally-solidified Ag-Cu eutectic alloys. The results indicated that the relationship between the lamellar spacing of directionally-solidified Ag-Cu alloys and the growth rate matched the prediction of the Jackson-Hunt model, and the constant was 5.8 µm3/s. The increasing external magnetic field during solidification tilted the growth direction of the lamellar eutectics, and coarsened the eutectic lamellar spacing. These decreased the microhardness and strength of Ag-Cu alloys, but increased their electrical conductivity. The competitive strengthening contributions between the refinement of the eutectic lamellar spacing and the change in growth direction of the eutectics resulted in higher strength in the as-rolled sample with a 0.8 T magnetic field than with other samples, which was confirmed from higher relieved deformation energy using differential scanning calorimetry.

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Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

Influence of Growth Rate and Magnetic Field on Microstructure and Properties of Directionally Solidified Ag-Cu Eutectic Alloy

et al. 2016

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“…The strength of the Cu matrix ( τ Cu matrix ) was determined by the superposition of several strengthening partitions: solid solution hardening ( τ ss ), precipitation hardening ( τ Precipitation ), and grain boundary hardening ( τ Grain ) [ 54 ]. The strength of the Cu matrix increased due to these individual contributions, which can be formulated by Equation (4):

where τ ss,Ag and τ ss,Fe are the solid solution hardening of supersaturated Ag and Fe in the Cu matrix.…”

Section: Discussionmentioning

confidence: 99%

Co-Precipitation, Strength and Electrical Resistivity of Cu–26 wt % Ag–0.1 wt % Fe Alloy

Wang

Zuo

2017

Materials

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Both a Cu–26 wt % Ag (Fe-free) alloy and Cu–26 wt % Ag–0.1 wt % Fe (Fe-doping) alloy were subjected to different heat treatments. We studied the precipitation kinetics of Ag and Cu, microstructure evolution, magnetization, hardness, strength, and electrical resistivity of the two alloys. Fe addition was incapable of changing the precipitation kinetics of Ag and Cu; however, it decreased the size and spacing of rod-shaped Ag precipitates within a Cu matrix, because Fe might affect the elastic strain field and diffusion field, suppressing the nucleation of Ag precipitates. Magnetization curves showed that γ-Fe precipitates were precipitated out of the Cu matrix, along with Ag precipitates in Fe-doping alloy after heat treatments. The yield strength of the Fe-doping alloy was higher than that of the Fe-free alloy, and the maximum increment was about 41.3%. The electrical conductivity in the aged Fe-doping alloy was up to about 67% IACS (International Annealed Copper Standard). Hardness, strength, and electrical resistivity were intensively discussed, based on the microstructural characterization and solute contributions of both alloys. Our results demonstrated that an increasing fraction of nanoscale γ-Fe precipitates and decreasing spacing between Ag precipitates resulted in the increasing strength of the Fe-doping alloy.

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“…The properties of the Cu-Ag alloy originate from its microstructure, which arises from the chemical composition as well as from the thermomechanical treatment [3,5,6]. Because of the beneficial combination of these properties, these alloys have been considered for use as conductor materials for pulsed high field magnets [7][8][9][10]. A magnetic flux density above 50 T can only be achieved using pulsed magnets.…”

Section: Introductionmentioning

confidence: 99%

“…When high strength conductor materials such as Cu-Ag alloys are used, the magnets can be pulsed non-destructively. The maximum flux density that has been achieved with a Cu-Ag material and a nondestructive monolithic coil amounts to 66 T [10]. Even higher magnetic fields of up to 88.9 T have been achieved with a system of two concentrically arranged coils [11,12].…”

Section: Introductionmentioning

confidence: 99%

Microstructural inhomogeneities in Cu–Ag–Zr alloys due to heavy plastic deformation

Lyubimova

Freudenberger

Mickel

et al. 2010

Materials Science and Engineering: A

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Non-destructive pulsed field CuAg-solenoids

Cited by 49 publications

References 45 publications

Influence of Growth Rate and Magnetic Field on Microstructure and Properties of Directionally Solidified Ag-Cu Eutectic Alloy

Influence of Growth Rate and Magnetic Field on Microstructure and Properties of Directionally Solidified Ag-Cu Eutectic Alloy

Co-Precipitation, Strength and Electrical Resistivity of Cu–26 wt % Ag–0.1 wt % Fe Alloy

Microstructural inhomogeneities in Cu–Ag–Zr alloys due to heavy plastic deformation

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