Abstract:Considering the problem of measuring the peak junction temperature of a double-chip module with temperature inhomogeneity, we use a double-chip parallel model to analyze peak junction temperature measurement error for the traditional electrical method. An improved test method is proposed that is based on the small current–voltage drop method—specifically the dual current test method employing an extended-dimension calibration curve library. This method realizes a match of the calibration current with the test … Show more
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