Non-destructive measurement of bottom width in deep trench isolation structures using IRCD metrology
Nick Keller,
Marc Poulingue,
Ross Grynko
et al.
Abstract:As scaling in semiconductor devices continues, the aspect ratios of deep trench isolation (DTI) structures have increased. DTI structures are used in power devices, power management ICs and image sensors as a method to isolate active devices by reducing crosstalk, parasitic capacitance, latch-up and allowing for an increase breakdown voltage of active devices. Measurement of these structures in high volume manufacturing (HVM), with non-destructive technology, has mostly been limited to the depth and top width … Show more
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