2018 IEEE 68th Electronic Components and Technology Conference (ECTC) 2018
DOI: 10.1109/ectc.2018.00118
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Non-destructive Inspection of Flip-Chip BGA Solder Ball Defects Using Two Laser Beam Probe Ultrasonic Inspection Technique

Vishnu V. B. Reddy
1
,
I. Charles Ume
2
,
Aaron Mebane
3
et al.
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