Non destructive control of flip chip packages for space applications

Paillard, M.; Schaffauser, C.; Drevon, C.; Cazaux, J.-L.; Schubach, Hans Reinhard; Frese, F.

doi:10.1016/j.microrel.2004.07.033

Microelectronics Reliability

2004

DOI: 10.1016/j.microrel.2004.07.033

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Non destructive control of flip chip packages for space applications

M. Paillard¹,

C. Schaffauser²,

C. Drevon³

et al.

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Non destructive control of flip chip packages for space applications

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