Abstract:Failure analysis on TBGA (Tape Ball Grid Array) package devices is a rather difficult task, due to the material used for assembly. This paper will introduce two novel techniques for non-destructive deprocessing procedures used in performing analysis on TBGA devices. These new techniques do not introduce additional failures to the devices during the deprocessing procedure. The workable TBGA devices can then be powered up and analyzed using different techniques and equipment. In the first technique, molding comp… Show more
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