Abstract:In this paper we will discuss an empirically discovered technique to remove residual solder bumps or remnants using reflow and wicking to a gold plated surface rather than mechanical or chemical means. Extraction of flip chip ICs, for the purpose of repackaging, can leave bond pads in inconsistent and undesirable conditions such as 1) retaining remnants of the solder bumps or 2) damaged or eliminated pad metal caused by acid or mechanical means used to separate the IC from the board. These conditions hinder su… Show more
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