2020
DOI: 10.1109/lca.2020.2990599
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NoM: Network-on-Memory for Inter-Bank Data Transfer in Highly-Banked Memories

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Cited by 27 publications
(15 citation statements)
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“…This key takeaway shows that the workloads most well-suited for the UPMEM PIM architecture are those with little or no inter-DPU communication. Based on this takeaway, we recommend that the hardware architecture and the software stack be enhanced with support for inter-DPU communication (e.g., by leveraging new in-DRAM data copy techniques [39,207,218,219,222,223,245] and providing better connectivity inside DRAM [39,207]).…”
Section: Key Takeawaymentioning
confidence: 99%
“…This key takeaway shows that the workloads most well-suited for the UPMEM PIM architecture are those with little or no inter-DPU communication. Based on this takeaway, we recommend that the hardware architecture and the software stack be enhanced with support for inter-DPU communication (e.g., by leveraging new in-DRAM data copy techniques [39,207,218,219,222,223,245] and providing better connectivity inside DRAM [39,207]).…”
Section: Key Takeawaymentioning
confidence: 99%
“…For example, heterogeneous architectures in modern SoCs can stress the interconnect through their imbalanced loads that are a consequence of largely different demands across many different types of applications and accelerators. Relatively new technology such as chiplets [119,120] or new types of memory [121][122][123] can create demands for efficient interconnection network designs that connect multiple memory nodes together. Especially processing-inmemory systems can require well-connected memory arrays via efficient interconnects to tightly couple computation and communication.…”
Section: Conclusion and Future Outlookmentioning
confidence: 99%
“…This key takeaway shows that the workloads most well-suited for the UPMEM PIM architecture are those with little or no inter-DPU communication. Based on this takeaway, we recommend that the hardware architecture and the software stack be enhanced with support for inter-DPU communication (e.g., by leveraging new in-DRAM data copy techniques [117,121,125,126] and providing better connectivity inside DRAM [121,125]).…”
Section: Key Takeawaymentioning
confidence: 99%