We have investigated the relationship between improved electrical properties of Al 2 O 3 /AlGaN/GaN metal-oxide-semiconductor high-electron-mobility transistors (MOS-HEMTs) and electronic state densities at the Al 2 O 3 /AlGaN interface evaluated from the same structures as the MOS-HEMTs. To evaluate Al 2 O 3 /AlGaN interface state densities of the MOS-HEMTs, two types of capacitance-voltage (C-V) measurement techniques were employed: the photo-assisted C-V measurement for the near-midgap states and the frequency dependent C-V characteristics for the states near the conduction-band edge. To reduce the interface states, an N 2 O-radical treatment was applied to the AlGaN surface just prior to the deposition of the Al 2 O 3 insulator. As compared to the sample without the treatment, the N 2 O-radical treated Al 2 O 3 /AlGaN/GaN structure showed smaller frequency dispersion of the C-V curves in the positive gate bias range. The state densities at the Al 2 O 3 /AlGaN interface were estimated to be 1 Â 10 12 cm À2 eV À1 or less around the midgap and 8 Â 10 12 cm À2 eV À1 near the conduction-band edge. In addition, we observed higher maximum drain current at the positive gate bias and suppressed threshold voltage instability under the negative gate bias stress even at 150 C. Results presented in this paper indicated that the N 2 O-radical treatment is effective both in reducing the interface states and improving the electrical properties of the Al 2 O 3 /AlGaN/GaN MOS-HEMTs. V C 2013 AIP Publishing LLC. [http://dx