1980
DOI: 10.1016/0040-6090(80)90257-6
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Nitride film deposition by reactive ion beam sputtering

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1984
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Cited by 42 publications
(3 citation statements)
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“…Multiple ion sources can also be used to provide extra ion bombardment of the substrate itself to influence film growth or to pre-clean the substrate before sputter deposition begins. Using reactive gases, such as oxygen, allows dielectrics to be deposited in a process known as reactive sputtering [105,107]. Here a plasma dissociates the feedstock gas, and the reaction products chemically interact with the target.…”
Section: Plasma Depositionmentioning
confidence: 99%
“…Multiple ion sources can also be used to provide extra ion bombardment of the substrate itself to influence film growth or to pre-clean the substrate before sputter deposition begins. Using reactive gases, such as oxygen, allows dielectrics to be deposited in a process known as reactive sputtering [105,107]. Here a plasma dissociates the feedstock gas, and the reaction products chemically interact with the target.…”
Section: Plasma Depositionmentioning
confidence: 99%
“…This is primarily due to limitations concerning its low deposition rate, complex maintenance, high cost and limited scalability for industrial application. Few studies investigated the impact of different process parameters including the ion beam energy [14][15][16], deposition temperature [17] and nitrogen partial pressure [18] on the optical and electrical properties of the silicon nitride film however none of these studies focuses on the coatings properties that relevant to GWDs research (i.e mechanical loss and optical absorption).…”
Section: Introductionmentioning
confidence: 99%
“…Its advantages are transparency in VIS and NIR spectra, together with wide range of refractive index varying between 2.063 for Si 3 N 4 [4] and 1.468 for SiO 2 [5] at the wavelength 500 nm. A variety of techniques can be used for SiO x N y deposition, including plasma enhanced chemical vapour deposition [6], ion assisted deposition [7], magnetron sputtering [8], or dual ion beam sputtering (DIBS) [9][10][11][12].…”
Section: Introductionmentioning
confidence: 99%