Proceedings of IEEE Sensors 2003 (IEEE Cat. No.03CH37498)
DOI: 10.1109/icsens.2003.1279025
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NiColoy: a versatile electroforming process for bio-sensor fabri cation by embossing

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“…A current of 10–20 mA cm −2 was used to produce a 0.5 mm-thick electroform of approximately 98% nickel and 2% cobalt in 24 h. Upon completion, the silicon wafer was chemically dissolved in a solution of KOH. 36 The resulting nickel mold was used to emboss the thermoplastic membranes. Prior to embossing, the patterned face of the nickel mold was soaked in a 1 mM solution of hexadecanethiol (HDT), which formed a self-assembled monolayer (SAM) to decrease surface energy to aid in subsequent polymer release.…”
Section: Methodsmentioning
confidence: 99%
“…A current of 10–20 mA cm −2 was used to produce a 0.5 mm-thick electroform of approximately 98% nickel and 2% cobalt in 24 h. Upon completion, the silicon wafer was chemically dissolved in a solution of KOH. 36 The resulting nickel mold was used to emboss the thermoplastic membranes. Prior to embossing, the patterned face of the nickel mold was soaked in a 1 mM solution of hexadecanethiol (HDT), which formed a self-assembled monolayer (SAM) to decrease surface energy to aid in subsequent polymer release.…”
Section: Methodsmentioning
confidence: 99%