Nickel electrodeposition using EnFACE

Widayatno, Tri; Roy, Sudipta

doi:10.1007/s10800-014-0686-y

Cited by 6 publications

(7 citation statements)

References 36 publications

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“…This cell is capable of placing the anode and cathode in close proximity; the methodology has been described in detail elsewhere. 35,44 The cell was equipped with US apparatus supplied by SONICS Vibra-Cell which consisted of a VC505 Processor connected to a 20 kHz ultrasound probe with a 13 mm diameter titanium alloy tip, and placed 3 cm away from the two electrodes, as shown in the figure. The cell was filled with 500 mL of 0?1M CuSO 4 solution.…”

Section: Methodsmentioning

confidence: 99%

“…In prior studies of EnFACE it has been shown that reaction products, such as gas bubbles and metal particles can get entrapped within the narrow gap, thereby causing problems in metal dissolution 31 and deposition. 35 Using such intense agitation can be useful in removing reaction products from narrow spaces.…”

Section: Ultrasonic Agitationmentioning

confidence: 99%

“…[31][32][33] In this technique, the anode and cathode are placed in close proximity (,0?5 mm) with electrolyte flowing through the inter-electrode gap. Microscale metallic patterns can be transferred from one electrode to another without the use of a patterned mask, provided that appropriate electrolyte, 34,35 and agitation [34][35][36] are provided. Sufficient agitation has been implemented previously for the EnFACE technique with the use of a vertical flow cell.…”

Section: Introductionmentioning

confidence: 99%

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Combined pulsing currents and agitation for electrodeposition

Coleman

Roy

2014

Transactions of the IMF

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In order to exploit the full potential of current pulsing one may need to combine it with synchronised and pulsing solution agitation. The problem with providing pulsing agitation is that changes in the momentum boundary layer have a much larger time constant than that required for changing reaction conditions at the electrode surface. One agitation scheme which may not have this limitation is ultrasonication. Ultrasonic (US) transducers respond to pulsing electrical signals which can be switched within a second. In industrial tank systems the transducers are loaded on the wall of a tank, which allows the agitation to be transferred into the electrolyte immediately. In the current work, the effect of continuous vs pulse US agitation on metal deposition under mass transfer limitations has been examined. In order to test the applicability of this concept, copper has been deposited at a cathode which is separated from the anode by a gap of 0?3 mm using direct current and pulsing current deposition under silent and ultrasonic agitation conditions. The cell potential has been monitored to determine the stability of the process. Deposit roughness was determined as a test of process performance. To the authors' knowledge, this work provides the first assessment of combining these two different pulsing parameters for electrodeposition.

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Section: Methodsmentioning

confidence: 99%

Section: Ultrasonic Agitationmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Combined pulsing currents and agitation for electrodeposition

Coleman

Roy

2014

Transactions of the IMF

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“…Further refinements of the process focused on achieving high rates of deposition [25,26] and better knowledge of the effect of process parameters on deposit morphology and crystallinity [27,28]. Innovations to extend technology capability focused on pulse deposition [29][30][31], microscale manufacturing [32] using LIGA techniques [33,34], and mask-less microfabrication [35].…”

Section: Background and Empirical Experiencementioning

confidence: 99%

Electroforming in the Industry 4.0 Era

Roy

Andreou

2020

Current Opinion in Electrochemistry

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In the Industry 4.0 Era big data and automation will require precise knowledge that allows one to control, monitor and predict a process. Electroforming, which is the fabrication of freestanding components using electrodeposition, is rapidly gaining acceptance as a sustainable additive manufacturing technology. However, current knowledge of electroforming is based on empirical data, and academic engagement in this area has been limited. This paper throws light on some of the complex issues surrounding the electrochemical and chemical behaviour during electroforming which are yet unresolved. The differences between cathodic reactions in sulphamates and sulphates, ambiguities related to the role of boric acid, and paucity of data on anode reactions are highlighted. Reactions involving Cl-: Cl-→ Cl2 + 2e -2 [NH2SO3]H + 3 Cl2 + 2 H2O → N2 + H2SO4 + 6 HCl [24]

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“…In the past decade the Electrochemical nano and micro fabrication by Flow and Chemistry (EnFACE) process, developed by Roy et al [11][12][13][14][15] has offered the possibility of mask-less deposition and dissolution of fine copper lines. The EnFACE electrolyte chemistry is copper sulfate-based, containing low copper salt concentration, acid-free and additive-free.…”

Section: Introductionmentioning

confidence: 99%