1990
DOI: 10.1016/0169-4332(90)90054-4
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Nickel, cobalt and iron silicide formation stimulated by Argon implantation

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Cited by 3 publications
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“…[15] FeSi 2 thin film (iron deposited thickness is 4-100 nm) annealed from 400-950 • C for 10-40 s, has a resistivity of about 60-80 µΩ•cm at room temperature. [16] Using c-AFM, we obtain ρ = 225 µΩ•cm for NWs. One can expect that the resistivity in the NWs to be larger than bulk values due to intrinsic effects including interface scattering along the length of the NW and possibly onedimensional confinement effects.…”
mentioning
confidence: 94%
“…[15] FeSi 2 thin film (iron deposited thickness is 4-100 nm) annealed from 400-950 • C for 10-40 s, has a resistivity of about 60-80 µΩ•cm at room temperature. [16] Using c-AFM, we obtain ρ = 225 µΩ•cm for NWs. One can expect that the resistivity in the NWs to be larger than bulk values due to intrinsic effects including interface scattering along the length of the NW and possibly onedimensional confinement effects.…”
mentioning
confidence: 94%