Ni–Cu interdiffusion and its implication for ageing in Ni-coated Cu conductors

Wang, Zijing; Fang, Le; Cotton, Ian; Freer, Robert

doi:10.1016/j.mseb.2015.04.006

Cited by 29 publications

(16 citation statements)

References 30 publications

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“…It has been recognized that the temperature dependence of interdiffusion coefficients obey the Arrhenius relationship given below [8] :…”

Section: Concentration-dependent Activation Energy and Frequency Fmentioning

confidence: 99%

“…Previous studies on diffusion have shown that the activation energy and pre-exponential factor in the Arrhenius equation can systematically vary with concentration as the interdiffusion coefficient changes with concentration. [8] Considering that concentration-dependent activation energy and frequency factor values are calculated from interdiffusion coefficient data, their accuracy and reliability depend on the method of analysis used to compute the interdiffusion coefficients. Furthermore, in reported works in the literature on concentration-dependent activation energy and frequency factor, authors generally used a single diffusion time that they kept constant at various temperatures.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Change in Concentration-Dependent Diffusion Activation Energy and Frequency Factor with Time: Identified by Numerical Analyses of Experimental Data

Olaye

Ojo

2020

Metall Mater Trans A

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A newly developed fully explicit numerical diffusion model coupled with a forward simulation technique, to avoid flaws in conventional methods such as the Boltzmann-Matano, Sauer-Freise and Hall procedures, is used to compute the concentration-dependent activation energy and frequency factor for diffusion in two different alloy systems. In contrast to what has been commonly reported in the literature, the results show that the concentration dependence of activation energy and frequency factor can significantly change with time. In this situation, the use of concentration-dependent activation energy and frequency factor that does not vary with time to predict diffusion effect can lead to considerable error. Furthermore, when there is a time variation in the dependence of activation energy and frequency factor on concentration, a common expectation that diffusion-controlled kinetics would increase with an increase in temperature may not always apply for all time durations.

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“…It has been recognized that the temperature dependence of interdiffusion coefficients obey the Arrhenius relationship given below [8] :…”

Section: Concentration-dependent Activation Energy and Frequency Fmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Change in Concentration-Dependent Diffusion Activation Energy and Frequency Factor with Time: Identified by Numerical Analyses of Experimental Data

Olaye

Ojo

2020

Metall Mater Trans A

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“…17,18 To reduce the rate of the dissolving reaction and minimise the particle internalisation process, 19 the Cu substrate can be coated with Ni. 20 This interlayer between liquid metals and Cu substrate causes a reduction in the diffusion of Ga to the Cu substrate by the formation at the interlayer of intermetallic compounds from the Ga-Ni system, 21 which reduces diffusion of Cu to Ga. The aim of this study is to demonstrate the effect of time and temperature on the kinetics of the formation and growth of the intermetallic layer at the interface of liquid eutectic Ga-Sn-Zn and Ni substrate.…”

Section: Introductionmentioning

confidence: 99%

Interfacial Phenomena between Liquid Ga-Based Alloys and Ni Substrate

Gancarz

Berent

Schell

et al. 2019

Journal of Elec Materi

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In this study, wetting tests for Ni substrate with eutectic Ga-Sn-Zn are carried out using the sessile drop method. The experiments are performed for 1, 10 and 30 days of contact, at temperatures of 100°C, 150°C and 250°C. Selected liquid/substrate couples are cross-sectioned and subjected to scanning electron microscopy with energy dispersive spectroscopy for interfacial microstructure investigation. Phase identification is carried out using synchrotron x-ray diffraction. The growth of the intermetallic Ni-Ga phase layer is studied at the liquid/Ni substrate interface, and the kinetics of the formation and growth of this layer are determined.

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“…Metallic multilayer materials, also called multilayer composites [1,2], cladding materials [3], clad composites [4,5], clad plates [6,7], bimetal composites [8,9] , composite rods [10,11] and clad wires [12], have been widely used in many industrial fields such as kitchen utensils [6,[13][14][15], automobile industry [9,14,16,17], aerospace [6,18], shipbuilding [6], biomedical devices [19] and heat exchangers [9,14,16,17]. Various combinations of materials like Al/St [6,9,20], Al/Ti [7,18,21,22], Al/Mg [11], Al/Ag [23], Al/Cu/Al [4,5], Cu/Zn/Al [1], STS/ Al/Cu [13], Cu/Ti [8], Ti/Cu/Ti [24], Ni/Cu [16] and Cu/St [12,25] have been employed to exploit excellent mechanical, physical, and chemical properties of each material in a new unit material. Copper cl...…”

Section: Introductionmentioning

confidence: 99%

An investigation on micro-hardness, micro-structure and ductility of clad layer in copper clad aluminum wire under multi stage–NCWD

Sichani

Rahnama

Raghebi

et al. 2020

Mater. Res. Express

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The copper clad aluminum (CCA) wire was fabricated by roll forming of copper foil around the aluminum wire rode. Non-continuous wire drawing (NCWD) was employed to study the effect of wire drawing parameters on ductility, micro-hardness and microstructure of the copper clad layer. The NCWD process continued without intermediate annealing until cracks were observed on the copper clad layer. The cracks appeared after a 78% reduction in the cross-section. The micro-tensile test was performed on specimens with transverse curvature to determine elongation. A modified correction factor was introduced to correct the effect of curvature size on elongation. The introduced correction factor proportional to the sample characteristics was between 0.7 and 1.4. Moreover, variations in the hardness and microstructure of the copper clad layer were investigated in the base metal and at the welding zone. Before beginning the wire drawing process for the annealed CCA wire with a diameter of 10.1mm and a Cu clad thickness of 0.48mm , the hardness, ductility, UTS and grain size of the clad layer were 87HV, 43%, 103MPa and 80 μm, respectively. At the end of NCWD for 10°a nd the 20% reduction ratio of the die, the diameter of CCA wire reached 4.7mm with a 0.22mm thickness of Cu clad. The hardness, ductility, UTS and grain size of the clad layer were 157HV, 2.9%, 325MPa and 8 μm, respectively.

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Ni–Cu interdiffusion and its implication for ageing in Ni-coated Cu conductors

Cited by 29 publications

References 30 publications

Change in Concentration-Dependent Diffusion Activation Energy and Frequency Factor with Time: Identified by Numerical Analyses of Experimental Data

Change in Concentration-Dependent Diffusion Activation Energy and Frequency Factor with Time: Identified by Numerical Analyses of Experimental Data

Interfacial Phenomena between Liquid Ga-Based Alloys and Ni Substrate

An investigation on micro-hardness, micro-structure and ductility of clad layer in copper clad aluminum wire under multi stage–NCWD

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