Next-generation lithography mask development at the NGL Mask Center of Competency

Lercel, Michael J.; Brooks, Cameron J.; Racette, Kenneth C.; Magg, Christopher; Lawliss, Mark; Caldwell, Neal; Jeffer, Raymond; Collins, Kevin; Barrett, Monica; Nash, Steven C.; Trybendis, Michael J.; Bouchard, Lucien

doi:10.1117/12.373374

Cited by 3 publications

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“…EPL mask fabrication has been discussed in detail in previous papers [3][4][5]. The masks referenced in this paper are based upon 100mm diameter silicon wafers with a surface layer that is either doped with boron or boron-germanium.…”

Section: Mask Blank Fabricationmentioning

confidence: 99%

Image Placement Distortions in EPL Masks

Thiel¹,

Kindt²,

Lawliss³

2002

SPIE Proceedings

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Electron projection lithography (EPL) is a promising candidate for the next generation lithography choice. There are several advantages to EPL, such as a large depth of focus and a lower relative mask cost. Significant challenges also face this technology, including the limitation of the membrane format of the mask. One of the obstacles with the membrane format is image placement distortions, which can be very sensitive to the stress of the membrane as well as the pattern density. This paper studies how the stress of various types of films effects image placement distortions, as well as examines the effect of final mask cleans on image placement distortions.

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Section: Mask Blank Fabricationmentioning

confidence: 99%

Image Placement Distortions in EPL Masks

Thiel¹,

Kindt²,

Lawliss³

2002

SPIE Proceedings

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“…[1][2][3] The mask is based upon a silicon wafer with a surface layer membrane of either ~2 µm silicon or diamond for stencil masks or ~100 nm silicon nitride for a continuous membrane mask. The finished mask blank consists of an array of small membranes separated by struts for rigidity.…”

Section: Mask Fabricationmentioning

confidence: 99%

Analysis of critical parameters for EPL mask fabrication

Lercel¹

2002

Emerging Lithographic Technologies VI

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Electron projection lithography (EPL) requires mask formats that are significantly different from those used in traditional optical lithography. These masks must consist of a thin membrane that is either patterned with transmissive perforations for stencil masks or patterned with a scatterer layer to form a continuous membrane mask. In this paper, the critical requirements for fabrication of EPL masks are discussed. Challenges for mask blank fabrication, image size uniformity, image placement accuracy, and defect control are presented with examples from mask fabrication. The impact of these parameters on EPL mask cost is then discussed. The mask cost is compared for different critical device levels and for different chip sizes. The influence of mask parameters and need for complementary masks drives higher mask costs for certain device levels. By examining the factors influencing mask cost for certain levels, the areas of mask technology that are most critical to controlling mask cost can be identified.

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Benchmarking stencil reticles for electron projection lithography

Wood¹,

Trybula²,

Lercel

et al. 2003

Journal of Vacuum Science &Amp; Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena

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Electron projection lithography ͑EPL͒ is one of the leading candidates for next-generation lithography at the 65 nm lithography node, particularly for contact levels. This article describes the results of an experimental effort to benchmark the current state of EPL stencil mask making. In this article, we report on the current status of the data handling software needed to pattern an EPL stencil reticle, EPL stencil reticle repair techniques, and EPL stencil mask stability following prolonged electron-beam irradiation.

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Next-generation lithography mask development at the NGL Mask Center of Competency

Cited by 3 publications

References 0 publications

Image Placement Distortions in EPL Masks

Image Placement Distortions in EPL Masks

Analysis of critical parameters for EPL mask fabrication

Benchmarking stencil reticles for electron projection lithography

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