New SWEAT method for fast, accurate and stable electromigration testing on wafer level

Hagen, J. von; Gallet, Antonin; Fazekas, J.; Head, Linda; Schafft, H.A.

doi:10.1109/irws.2000.911906

Cited by 11 publications

(2 citation statements)

References 3 publications

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“…Secondly, costs are enormous: the purchase of dedicated equipment, the wafers, and the packaging of samples in ceramic housings. For these reasons fast wafer level EM (WL-EM) has been given a lot of attention and many investigations have been carried out in the past two decades [1][2][3][4][5][6][7][8][9][10][11].…”

Section: Introductionmentioning

confidence: 99%

Fast electromigration wafer mapping for wafer fab process monitoring and improvement

Marwijk

Nath

2008

Microelectronics Reliability

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Section: Introductionmentioning

confidence: 99%

Fast electromigration wafer mapping for wafer fab process monitoring and improvement

Marwijk

Nath

2008

Microelectronics Reliability

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“…Many known reliability risks can be covered by fWLR monitoring, including dielectric reliability, electromigration (EM) and contact/via reliability as well as hot carrier degradation. For some stresses temperature acceleration is beneficial and local heaters [5] or self heating are applied [6]. There are different flavors of fWLR monitoring: some have a qualitative nature, i.e.…”

Section: Introductionmentioning

confidence: 99%

Efficient fWLR inline monitoring of hot carrier reliability by means of one simple, comprehensive parameter

Vollertsen

Nielen

2005 IEEE International Integrated Reliability Workshop

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Efficient, quantitative inline monitoring of reliability parameters requires considering various dependencies and influences. This work deals with monitoring of conducting hot carrier degradation -but works for other device stress types as well -and develops a single but comprehensive parameter for a control card, that takes into account the device length variation, deviation from a reference device (e.g. the nominal device) and deviation from device reliability model as determined during the process qualification. The derivation and implementation of the method and parameter is described in detail. Altemative parameter calculations are discussed. Examples are given to illustrate the feasibility and usability of the simple and comprehensive parameter.

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An introduction to fast wafer level reliability monitoring for integrated circuit mass production

Martin

Vollertsen

2004

Microelectronics Reliability

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New SWEAT method for fast, accurate and stable electromigration testing on wafer level

Cited by 11 publications

References 3 publications

Fast electromigration wafer mapping for wafer fab process monitoring and improvement

Fast electromigration wafer mapping for wafer fab process monitoring and improvement

Efficient fWLR inline monitoring of hot carrier reliability by means of one simple, comprehensive parameter

An introduction to fast wafer level reliability monitoring for integrated circuit mass production

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