New Sonic Cleaning Technology for Particle Removal from Semiconductor Surfaces

Berg, D.; Grimsley, T J; Hammond, Paul S.; Sorenson, Caitlin

doi:10.1007/978-1-4613-0531-6_25

Cited by 4 publications

(1 citation statement)

References 2 publications

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“…Several mechanical methods for the removal of small particles from surfaces are known, including ultrasonics, , megasonics, wiping, brush scrubbing, low-pressure spraying, high-pressure jet spraying, etching, and centrifugal spraying. , Frequently, however, these methods are ineffective when applied to particles with diameters of less than about 1 μm. ,, The use of surfactants may be efficient for the removal of micron-sized particles but bears the risk of surfactant adsorption to the surface, which can be troublesome for future application.…”

Section: Introductionmentioning

confidence: 99%

Removal of Colloidal Particles from Quartz Collector Surfaces As Stimulated by the Passage of Liquid−Air Interfaces

1999

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Micron-sized particles adhering to collector surfaces can be detached by passing a liquid−air interface over the adhering particles. Theoretically, the efficiency of particle detachment depends on the interface velocity, the liquid surface tension, the viscosity, and the particle−substratum interaction forces. In this study we perfuse an air bubble through a parallel-plate flow chamber to study detachment of polystyrene particles from a quartz collector surface, at different interface velocities and liquid surface tensions and upon multiple air bubble passages. A linear relation was found between particle removal and the liquid−air interface velocity, with negligible removal at elevated velocities. Linear relations were also found between particle removal and the liquid−air surface tensions, with different slopes for different air bubble velocities. Particle removal could be increased by the passage of multiple air bubbles. In summary, this study shows that liquid−air interfaces can be employed to detach micron-sized particles from collector surfaces. The detachment process can be optimized by adjusting the air bubble velocities, the surface tensions, and the number of bubbles applied.

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