2024
DOI: 10.20944/preprints202404.0118.v1
|View full text |Cite
Preprint
|
Sign up to set email alerts
|

New Solution of the Grain Boundary Grooving Problem in Polycrystalline Thin Films when Evaporation and Diffusion meet in Power Electronic Devices

Tayssir Hamieh,
Ali Ibrahim,
Zoubir Khatir

Abstract: This paper constituted an extension of two previous studies concerning the mathematical development of the grain boundary grooving in polycrystalline thins films in the cases of the evaporation/condensation and diffusion taken separately. The thermal grooving processes are deeply controlled by the various mass transfer mechanisms of evaporation–condensation, surface diffusion, lattice diffusion, and grain boundary diffusion. This study proposed a new original analytical solution to the mathematical problem gov… Show more

Help me understand this report
View published versions

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

0
0
0

Publication Types

Select...

Relationship

0
0

Authors

Journals

citations
Cited by 0 publications
references
References 51 publications
0
0
0
Order By: Relevance

No citations

Set email alert for when this publication receives citations?