New soldering processes and solder systems for hybrid microsystems: developments and applications

Bobzin, Kirsten; Lugscheider, E.; Zhuang, H.L.; Ernst, F.; Bagcivan, Nazlim; Maes, M.; Rösing, J.; Ferrara, Stefania; Erdle, A.; Krämer, A.

doi:10.1007/s00542-006-0079-1

Cited by 6 publications

(2 citation statements)

References 8 publications

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“…Candidate processes are mainly high melting point solder bonding [3,4], transient liquid phase (TLP) bonding [5,6], and bonding using metal nanoparticles. Metal nanoparticle bonding is a solid-state bonding interconnection process based on sintering that generally uses Ag or Cu nanoparticles.…”

Section: Introductionmentioning

confidence: 99%

Effect of Au nanoporous structure on bonding strength

Matsunaga

Kim

Nishikawa

et al. 2015

2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC)

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Recently, several materials and joining processes have been proposed as alternatives to high-Pb-containing solders. There has been an increasing focus on developing solid-state bonding interconnection processes based on sintering, such as bonding techniques using Ag or Cu nanoparticles. However, sintered nanoparticle layers tend to have voids that result from solvent residue and dispersing agents. The voids in the sintered layer degrade the reliability of the joints. Therefore, we have proposed a solid-state bonding technique without solvents and flux using a nanoporous sheet. A nanoporous sheet can be made from binary alloy systems by dissolving the less noble component from the alloy selectively. A bonding technique using nanomaterials could reduce the bonding temperature because of the high reactive nanoporous surface. In this study, Au nanoporous sheets were fabricated by dealloying a Au-Ag alloy into an HNO 3 solution, and the effects of the Au nanoporous structure on joint bonding strength were investigated. After dealloying, Au nanoporous sheets were set between bare Cu substrates. The samples were bonded at various process temperatures under a nitrogen atmosphere. As a result, the joint bonded at 300 °C , using the Au nanoporous sheet with a dealloying time of 1 h, showed a high shear strength of about 20 MPa. It was found that joining using Au nanoporous bonding was successfully achieved.

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Section: Introductionmentioning

confidence: 99%

Effect of Au nanoporous structure on bonding strength

Matsunaga

Kim

Nishikawa

et al. 2015

2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC)

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“…These two techniques have been studied and evaluated as suitable for microjoining in previous research works. 13,14 The investigations presented in the present paper concern the development of new gold based soldering systems for both soldering techniques and their possible application for hybrid microsystems in the medical area. A continuous optimisation and modification of these newly developed soldering alloys have been carried out, according to the specific requirements of the microstructures being joined and to the environment where they must be employed.…”

Section: Introductionmentioning

confidence: 99%

Challenging gold based filler metals for uses in medicine

Bobzin¹,

Lugscheider²,

Ernst³

et al. 2009

Materials Science and Technology

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Research has been carried out to investigate new soldering materials and technologies for the medical field. The two soldering techniques, which have been considered, are diffusion and active soldering. In order to satisfy the most important medical requirement, the biocompatibility, gold based solders and soldering systems have been studied. According to the Directive 2002/95/EC of the European Parliament, lead as well as cadmium, hexavalent chromium and mercury have not been alloyed in the developed solders. The examined soldering systems enable joining similar and dissimilar materials, which is essential in the field of hybrid microsystems engineering. Furthermore, the achieved low process temperatures reduce the incidence of damage and thermally induced stresses in the components being joined.

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