New Silver Paste for Die-Attaching Ceramic Light-Emitting Diode Packages

Kuramoto, Masafumi; Ogawa, S.; Niwa, Miki; Kim, Keun Soo; Suganuma, Katsuaki

doi:10.1109/tcpmt.2010.2103378

Cited by 29 publications

(11 citation statements)

References 4 publications

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“…There is also the cost advantage of using sub-micron-and micron-sized Ag particles, which are typically available at only one-tenth of the cost of Ag nanoparticles. 67 Another emerging trend in the formulation of sintered Ag pastes is the inclusion of silicon carbide (SiC), titania carbide (TiC), and hexagonal boron nitride (h-BN) 54,90 or Ag-plated kovar or kovar particles 91 into sintered Ag paste to reduce the CTE of the sintered Ag joint and the thermal stress exerted by the substrates or silicon dies. This constant change in materials formulation has led to a very crowded patent landscape, which may pose a problem during implementation.…”

Section: Formulation Of Sintered Ag Pastementioning

confidence: 99%

“…Instead of applying pressure, it is possible to use a silver paste containing 92.6 wt% Ag particles to produce sintered Ag joints during pressureless sintering. 39 Instead of specifying the wt% of silver, other researchers have specified the maximum carbon content of a silver paste to be less than 1 wt% to ensure that the silver fillers constituted a sufficient majority of the silver paste. 38 A high weight percentage of Ag particles necessitates the use of solvents, such as butanol, propanol, and ethanol, to control the viscosity of the Ag paste.…”

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confidence: 99%

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Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?

Siow

2014

Journal of Elec Materi

270

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Silver (Ag) has been under development for use as interconnect material for power electronics packaging since the late 1980s. Despite its long development history, high thermal and electrical conductivities, and lead-free composition, sintered Ag technology has limited market penetration. This review sets out to explore what is required to make this technology more viable. This review also covers the origin of sintered Ag, the different types and application methods of sintered Ag pastes and laminates, and the long-term reliability of sintered Ag joints. Sintered Ag pastes are classified according to whether pressure is required for sintering and further classified according to their filler sizes. This review discusses the main methods of applying Ag pastes/laminates as dieattach materials and the related processing conditions. The long-term reliability of sintered Ag joints depends on the density of the sintered joint, selection of metallization or plating schemes, types of substrates, substrate roughness, formulation of Ag pastes/laminates, joint configurations (i.e., joint thicknesses and die sizes), and testing conditions. This paper identifies four challenges that must be overcome for the proliferation of sintered Ag technology: changes in materials formulation, the successful navigation of the complex patent landscape, the availability of production and inspection equipment, and the health concerns of Ag nanoparticles. This paper is expected to be useful to materials suppliers and semiconductor companies that are considering this technology for their future packages.

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Section: Formulation Of Sintered Ag Pastementioning

confidence: 99%

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confidence: 99%

Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?

Siow

2014

Journal of Elec Materi

270

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“…Meanwhile, silver adhesives are usually applied to die‐attach materials in LED devices, being glued between the die and substrate. Such silver adhesives must possess low thermal resistance, good thermal conductivity, good reflectance and electrical conductivity, low heat degradation, and low temperature processing ability during assembly; they should not produce any volatile organic compound (VOC) emissions, that damage the fluorescent powder and reduce the life time of LED devices . The commercial silver adhesives applied to LED in the current study are shown in Table .…”

Section: Introductionmentioning

confidence: 99%

Effect of anhydride curing agents, imidazoles, and silver particle sizes on the electrical resistivity and thermal conductivity in the silver adhesives of LED devices

Chiang

Lin

Chen

et al. 2016

J of Applied Polymer Sci

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This study investigated the preparation of silver adhesives applied to a light‐emitting diode (LED) device as die‐attach materials consisting of silver particles, on epoxy resin, curing agents, and accelerants for complete curing at 150 °C for 30 min. For the epoxy resin, this study used 3,4‐epoxycyclohexyl‐methyl‐3,4‐epoxycyclohexanecarboxylate mixed with different types of anhydride curing agents such as 4‐methylcyclohexane‐1,2‐dicarboxylic anhydride and hexahydrophthalic anhydride as well as imidazole accelerants such as 2‐ethyl‐4‐methyl‐1H‐imidazole‐1‐propanenitrile, 2‐phenylimidazole, 2‐methylimidazole, 2‐phenyl‐2‐imidazoline, and 1,2‐dimethylimidazole. In addition, different size of silver particles and hybrid silver particles were used for the electrical resistivity and thermal conductivity of silver adhesives. Differential scanning calorimetric (DSC) measured conversion of silver adhesives based on different types and contents of the curing agents and accelerants under heating. The silver particles' distribution of silver adhesive also affected electrical resistance, as proved by scanning electronic microscopy (SEM) and four‐point probe. The obtained results showed that the silver adhesive containing an 100 wt % of epoxy resin mixed with 85 wt % of hexahydrophthalic anhydride, 1.0 wt % (weight of epoxy resin) of 2‐ethyl‐4‐methyl‐1H‐imidazole‐1‐propanenitrile, and 80 wt % (weight of epoxy resin) of hybrid silver particles (40 wt % 15 μm and 40 wt % 1.25 μm) was perfect, having the lowest electrical resistivity at 1.11 × 10−4 Ω·cm and good thermal conductivity at 3.2 W/m·K. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2016, 133, 43587.

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“…To assembly theses chips on packages, high-temperature die-attachment materials are required. Based upon our literature search, the only thing available is sintered nanosilver paste [8][9][10][11][12]. This new bonding method is gaining ground in applications.…”

Section: Introductionmentioning

confidence: 99%

The Strength of High-Temperature Ag–In Joints Produced Between Copper by Fluxless Low-Temperature Processes

Wu¹,

Lee

2014

Journal of Electronic Packaging

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Two copper (Cu) substrates were bonded using silver (Ag) and indium (In) and annealed at C to convert the joints into the solid solution (Ag) for enhanced strength and ductility. Cu-Cu pair was chosen so that the samples break in the joint during shear test. The upper Cu was electroplated with 15 lm Ag. The lower Cu was plated with 15 lm Ag, followed by In and 0.1 lm Ag to inhibit indium oxidation. Two designs were implemented, using 8 lm and 5 lm In, respectively. The Cu substrates were bonded at 180 C in 100 mTorr vacuum without flux. Afterwards, samples were annealed at 200 C for 1000 h (first design) and at 250 C for 350 h (second design), respectively. Scanning electron microscope with energy dispersive X-ray analysis (SEM and EDX) results indicate that the joint of the first design is an alloy of mostly (Ag) with micron-size Ag 2 In and (f) regions, and that of second design has converted to a single (Ag) phase. Shear test results show that the samples are very strong. The breaking forces far exceed requirements in MIL-STD-883 H standards. Fracture incurs inside the joint and is a mix of brittle and ductile modes or only ductile mode. The joint solidus temperatures are 600 C and 900 C for the first and second designs, respectively.

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New Silver Paste for Die-Attaching Ceramic Light-Emitting Diode Packages

Cited by 29 publications

References 4 publications

Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?

Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?

Effect of anhydride curing agents, imidazoles, and silver particle sizes on the electrical resistivity and thermal conductivity in the silver adhesives of LED devices

The Strength of High-Temperature Ag–In Joints Produced Between Copper by Fluxless Low-Temperature Processes

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